Piyas Chowdhury  Piyas Chowdhury photo       

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Post Doctoral Researcher
Thomas J. Watson Research Center, Yorktown Heights, NY, USA
  +1dash9149451565

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Piyas Chowdhury received his BSc in mechanical engineering from Bangladesh University of Engineering and Technology (2008), and MS (2011) and PhD (2016) from Department of Mechanical Science and Engineering (MechSE) in University of Illinois at Urbana-Champaign (UIUC). His dissertation addessed physics and mechanics of deformation in electrodeposited nano-structured materials and shape memory alloys. As a MechSE postdoc in 2016, Dr. Chowdhury investigated high temperature stress/strain behavior, fatigue, damage tolerance and microstructure of nanocrystalline alloys and carbon composites in collaboration with Honeywell Aerospace. He joined IBM Research in 2017, and is currently involved in semiconductor packaging research for IBM's next generation supercomputers.