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Contact Information

Stephan Paredes
Senior Engineer - Advanced Thermal Packaging
Zurich Research Laboratory, Zurich, Switzerland
SPAatzurich.ibm.com      +41dash44dash724dash84dash81


Stephan Paredes received his Bachelor's degree in Systems Enginerineg, major in Physics Engineering, from the University of Applied Science NTB in Buchs, Switzerland in 2000.

From 2001 to 2004, he worked at the Institute for Microsystems, Buchs, Switzerland, in the field of MEMS, optical packaging and waveguide technology for optical interconnects.

In 2004 he got his Post-Diploma Degree in Optical Systems Engineering.

From 2004 to 2007, he worked in the development of optical interconnects and packaging technology for PCBs at Varioprint AG in Heiden, Switzerland.

In 2008, he joined the IBM Research Laboratory in Zurich, Switzerland, where he is currently working on microprocessor liquid cooling, improved thermal interfaces and concentrated photovoltaic with the Advanced Thermal Packaging group.