- Optical Interconnects
- RF Circuits and Systems
- Digital Communication IC Design
- Circuit Test and Diagnostics Technology
- Mixed-signal Communication IC Design
- Electrical I/O Subsystems and Packaging
- Subsystem Cooling and Integration
- Digital Phase Locked Loop (DPLL)
Our mission is to extend IBM's technology and systems leadership while enabling new collaborative business opportunities through innovation in communication and computing sub-systems.
In support of this mission, our key focus is advancing the state of the art in the analysis, design, and characterization of communication and computing hardware at the component, sub-system, and system level:
* Component-level contributions are driven by our expertise in analog, mixed-signal, RF, and digital circuit design and in electrical and optical packaging technology.
* Sub-system and system-level contributions are driven by our expertise in optical, wired, and wireless links, electrical and optical test, sub-system cooling, and FPGA emulation and development platforms.