IBM Research Student Workshop on 3D System Integration       

links

IBM Research Student Workshop on 3D System Integration - overview


Jointly hosted by DA, EIP, VLSI Professional Interest Communities (PICs) at IBM Research

IBM Watson

IBM Thomas J. Watson Research Center
Yorktown Heights, NY, USA
October 21-22, 2010

Location: IBM Yorktown Room 26-014
Thursday, October 21, 2010:

09:30 - 10:00AM: Plenary Talk (Jeffrey Burns, Director, VLSI Systems)
10:00 - 10:15AM: Break
10:15 - 11:55AM: Technical Session - 3D System Design Practices I (4 talks)
  • Design and Test of 3D-MAPS, a 3D Die-Stack Many-Core Processor (Dean Lewis ---- Georgia Tech) abstract
  • Centip3De: A Near-Threshold 7-Layer 3D System With 128 ARM Cortex-M3 Cores and 256MB of DRAM (David Fick ---- U. of Michigan) abstract
  • Modeling and Analysis of Hierarchical PDN and Electromagnetic Susceptibility of DLL in 3D Integrated ICs using TSVs (Yujeong Shim ---- KAIST) abstract
  • Two 3DIC Case Studies: Memory-On-Logic and Logic-On-Logic (Thorlindur Thorolfsson ---- North Carolina State University) abstract
12:00 - 01:00PM: Lunch (IBM Yorktown Cafeteria)
01:00 - 02:40PM: Technical Session - 3D Tools and Testing (4 talks)
  • Junction-level Thermal Extraction and Simulation of 3DICs (Samson Melamed ---- North Carolina State University) abstract
  • 3D-Craft: UCLA 3D Physical Design Flow (Guojie Luo ---- UCLA) abstract
  • 3D IC Design and Test Methodologies (Yibo Chen ---- Penn State University) abstract
  • 3D Interconnection test structure and thermal management (Minki Cho ---- Georgia Tech) abstract
02:40 - 03:00PM: Break
03:00 - 04:40PM: Technical Session - 3D System Design Practices II (4 talks)
  • Power Delivery Issues in 3D ICs (Pulkit Jain ---- U. of Minnesota) abstract
  • A Peak Power-Aware Memory Access Scheduling for 3D Stacked DRAM (Dongki Kim ---- POSTECH, S. Korea) abstract
  • Heterogeneous 3D Integration of CMOS and MEMS/Sensors (Hyung Suk (James) Yang ---- Georgia Tech) abstract
  • Low-Power 3D CMOS/Nano Hybrid Reconfigurable Architecture (Ting-Jung Lin ---- Princeton University) abstract
06:00PM: Dinner

Friday, October 22, 2010:

09:30 - 10:00AM: Plenary Talk (Subramanian Iyer, IBM Fellow)
10:00 - 10:15AM: Break
10:15 - 11:55AM: Technical Session - 3D Modeling and Simulation (4 talks)
  • Electrical-Thermal Co-simulation of 3D Integrated Systems with Micro-fluidic Cooling and Joule Heating Effects (Jianyong Xie ---- Georgia Tech) abstract
  • Modeling and Analysis of TSV Noise Coupling and Noise Suppression using Several Shielding Structures (Jonghyun Cho ---- KAIST) abstract
  • Modeling and measurement of vertical coupling from 200MHz on-chip DC converter to 900MHz LNA in 3D-IC (Kyoungchoul Koo ---- KAIST) abstract
  • 3D TSV Electrical Characteristic Evaluation and Modeling (Zheng Xu ---- RPI) abstract
12:00 - 01:00PM: Lunch (IBM Yorktown Cafeteria)
01:00 - 02:30PM: One-on-one meeting with IBM Researchers
02:30 - 03:30PM: Blue-gene lab tour (Fred Mintzer, Program Director)

For more information, please contact:
Xiaoxiong Gu (xgu at us.ibm.com)
Haifeng Qian (qianhaifeng at us.ibm.com)
Jae-Joon Kim (jjkim2 at us.ibm.com)
Eren Kursun (ekursun at us.ibm.com)