Electrical Interconnect and Packaging (Computer Systems Design sub-discipline) Publications



2015


The 12-Core POWER8™ Processor With 7.6 Tb/s IO Bandwidth, Integrated Voltage Regulation, and Resonant Clocking
EJ Fluhr, S Baumgartner, D Boerstler, JF Bulzacchelli, T Diemoz, D Dreps, G English, J Friedrich, A Gattiker, T Gloekler, others
Deniz, J Warnock... - 2015 - ieeexplore.ieee.org, IEEE


2014

Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
J. Bai, D. Wang, S. W. Nam, H. Peng, R. Bruce, L. Gignac, M. Brink, E. Kratschmer, S. Rossnagel, P. Waggoner, K. Reuter, C. Wang, Y. Astier, V. Balagurusamy, B. Luan, Y. Kwark, E. Joseph, M. Guillorn, S. Polonsky, A. Royyuru, S. Papa Rao, G. Stolovitzky
Nanoscale 6(15), 8900--8906, 2014

High-voltage DC-DC power module development
Izuru Narita, Rick Fishbune, Randhir Malik, David Mohr, Harish Chandra, Mark Schaffer, Haley Fu
Electronics Packaging (ICEP), 2014 International Conference on, pp. 193--196

Latch-to-Latch CMOS-Driven Optical Link at 28 Gb/s
B Lee, S Kim, Y Lee, J Proesel, C Baks, A Rylyakov, C Schow
Conference on Lasers & Electro-optics (CLEO), 2014

64Gb/s Transmission over 57m MMF using an NRZ Modulated 850nm VCSEL
D Kuchta, A Rylyakov, C Schow, J Proesel, C Baks, P Westbergh, J Gustavsson, A Larsson
Optical Fiber Communication Conference (OFC), 2014

Monolithic Travelling-Wave Mach-Zehnder Transmitter with High-Swing Stacked CMOS Driver
D Gill, J Proesel, C Xiong, J Rosenberg, M Khater, T Barwicz, S Assefa, S Shank, C Reinholm, E Kiewra, J Ellis-Monaghan, S Kamlapurkar, W Green, Y Vlasov
Conference on Lasers & Electro-optics (CLEO), pp. SM2G--3, 2014

30Gbps Optical Link Utilizing Heterogeneously Integrated III-V/Si Photonics and CMOS Circuits
N Dupuis, B Lee, J Proesel, A Rylyakov, R Rimolo-Donadio, C Baks, C Schow, A Ramaswamy, J Roth, R Guzzon, B Koch, D Sparacin, G Fish
Optical Fiber Communication Conference (OFC), 2014

Distributed Electrode Mach-Zehnder Modulator with Double-Pass Phase Shifters and Integrated Inductors
D Gill, W Green, C Xiong, J Proesel, A Rylyakov, C Schow, J Rosenberg, T Barwicz, M Khater, S Assefa, S Shank, C Reinholm, E Kiewra, S Kamlapurkar, Y Vlasov
Conference on Lasers & Electro-optics (CLEO), pp. STh4M--6, 2014

Exploring the limits of high-speed receivers for multimode VCSEL-based optical links
N Dupuis, D Kuchta, F Doany, A Rylyakov, J Proesel, C Baks, C Schow, S Luong, C Xie, L Wang, S Huang, K Jackson, N Li
Optical Fiber Communication Conference (OFC), 2014

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Bing Dang, Joana Maria, Qianwen Chen, Jae-Woong Nah, Paul Andry, Cornelia Tsang, Katsuyuki Sakuma, Christy Tyberg, Raphael Robertazzi, Michael Scheuermann, others
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 1372--1377

Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module
James Warnock, Yuen Chan, Hubert Harrer, Sean Carey, Gerard Salem, Doug Malone, Ruchir Puri, Jeffrey Zitz, Adam Jatkowski, Gerald Strevig, others
2014 - ieeexplore.ieee.org, IEEE

Effective Post-silicon Failure Localization Using Dynamic Program Slicing
Ophir Friedler, Wisam Kadry, Arkadiy Morgenshtein, Amir Nahir, Vitali Sokhin
Proceedings of the Conference on Design, Automation \& Test in Europe, pp. 319:1--319:6, European Design and Automation Association, 2014

High-performance computing for the theoretical study of nanoscale and molecular interconnects
Rasit O. Topaloglu, Swati Manjari, Saroj Nayak
Nanotechnology: Concepts, Methodologies, Tools, and Applications, IGI Global, 2014

Technology implications on approximate computing
Rasit O. Topaloglu
Variability Modeling and Characterization Workshop, 2014

Heat-driven adsorption chiller systems for sustainable cooling applications
Patrick Ruch, Sarmenio Saliba, Chin Lee Ong, Yazid Al-Shehri, Abdalrahman Al-Rihaili, Ahmed Al-Mogbel, Bruno Michel
11th International Energy Agency Heat Pump Conference, 2014

PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs
Arvind Sridhar, Mohamed M Sabry, Patrick Ruch, David Atienza, Bruno Michel
Computer-Aided Design (ICCAD), 2014 IEEE/ACM International Conference on, pp. 527--534

Non-intrusive Scalable Memory Access Tracer
Nobuyuki Ohba, Seiji Munetoh, Atsuya Okazaki, Yasunao Katayama
QEST 2014

A Simulation Study of Oxygen Vacancy-Induced Variability in HfO₂/Metal Gated SOI FinFET
Amit Ranjan Trivedi, Takashi Ando, Amith Singhee, Pranita Kerber, Emrah Acar, David J Frank, Saibal Mukhopadhyay
2014 - ieeexplore.ieee.org, IEEE

Wafer-level non conductive films for exascale servers
A Horibe, S Kohara, H Mori, Y Orii
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, pp. 803--807

Hybrid Main Memory Using Electrically- and Optically-Attached Memories
Atsuya Okazaki, Nobuyuki Ohba, Yasunao Katayama
Proceedings of the IEEE Symposium on Low-Power and High-Speed Chips (COOLChips-XVII) 2014


2013

A Monolithic Microring Transmitter in 90 nm SOI CMOS Technology
J Rosenberg, W Green, J Proesel, S Assefa, D Gill, T Barwicz, S Shank, C Reinholm, M Khater, E Kiewra, S Kamlapurkar, Y Vlasov
IEEE Photonics Conference (IPC), 2013

60-Gb/s Receiver Employing Heterogeneously Integrated Silicon Waveguide Coupled Photodetector
B Lee, A Rylyakov, J Proesel, C Baks, R Rimolo-Donadio, C Schow, A Ramaswamy, J Roth, M Jacob-Mitos, G Fish
Conference on Lasers and Electro-Optics (CLEO), 2013

35-Gb/s VCSEL-Based Optical Link Using 32-nm SOI CMOS Circuits
J Proesel, B Lee, C Baks, C Schow
Optical Fiber Communication Conference (OFC), 2013

30-Gb/s 90-nm CMOS-Driven Equalized Multimode Optical Link
B Hamel-Bissell, J Proesel, B Lee, D Kuchta, A Rylyakov, C Schow
Optics Express 21(9), 10962-10968, Optical Society of America, 2013

A 56.1 Gb/s NRZ Modulated 850nm VCSEL-Based Optical Link
D Kuchta, C Schow, A Rylyakov, J Proesel, F Doany, C Baks, B Hamel-Bissell, C Kocot, L Graham, R Johnson, G Landry, E Shaw, A MacInnes, J Tatum
Optical Fiber Communication Conference (OFC), 2013

Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
Katsuyuki Sakuma, Edmund Blackshear, Krishna Tunga, Chenzhou Lian, Shidong Li, Marcus Interrante, Oswald Mantilla, Jae-Woong Nah
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 667--673

Hybrid Au-Au bonding technology using planar adhesive structure for 3D integration
Masatsugu Nimura, Jun Mizuno, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Shuichi Shoji
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 1153--1157

No Clean Flux technology for large die flip chip packages
Akihiro Horibe, Kang-Wook Lee, Keishi Okamoto, Hiroyuki Mori, Yasumitsu Orii, Yuki Nishizako, Osamu Suzuki, Yukio Shirai
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 688--693

Realization of ultra-low power I/O
Lei Shan, Timothy Dickson, Young Kwark, Christian Baks, Dale Becker, Roger Krabbenhoft, Timothy Chainer, Sebastian Mueller, Manabu Hoshino, Junji Kodemura, others
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 2218--2222

Thermally enhanced pre-applied underfills for 3D integration
Akihiro Horibe, Keishi Okamoto, Hiroyuki Mori, Yasumitsu Orii, Kohichiro Kawate, Yorinobu Takamatsu, Hiroko Akiyama
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 909--914

A 60GHz, Linear, Direct Down-Conversion Mixer with mm-Wave Tunability in 32nm CMOS SOI
M. Sanduleanu, A. Valdes-Garcia, Y. Liu, B. Parker, S. Shlafman, B. Sheinman, D. Elad, S. Reynolds and D. Friedman
IEEE Custom Integrated Circuits Conference, pp. 1--4, 2013

A 0.1pJ/b 5-to-10Gb/s Charge-Recycling Stacked Low-Power I/O for On-Chip Signaling in 45nm CMOS SOI
Y. Liu, P. Hsieh, S. Kim, J. Seo, R. Montoye, L. Chang, J. Tierno, and D. Friedman
IEEE Solid-State Circuits Conference (ISSCC), 2013

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, others
3D Systems Integration Conference (3DIC), 2013 IEEE International, pp. 1--8

Highly selective silicon nitride etching to Si and SiO2 for a gate sidewall spacer using a CF3I/O2/H2 neutral beam
Daiki Nakayama, Akira Wada, Tomohiro Kubota, Robert Bruce, Ryan M Martin, Moritz Haass, Nicholas Fuller, Seiji Samukawa
Journal of Physics D: Applied Physics 46(20), 205203, IOP Publishing, 2013

Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim
Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on, pp. 363--370

5.5 GHz system z microprocessor and multi-chip module
J Warnock, Yuen H Chan, Hubert Harrer, D Rude, Ruchir Puri, S Carey, Gerard Salem, Guenter Mayer, Yiu-Hing Chan, M Mayo, others
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International, pp. 46--47

Circuit and PD challenges at the 14nm technology node
James Warnock
Proceedings of the 2013 ACM international symposium on International symposium on physical design, pp. 66--67

Hardware-corroborated Variability-Aware SRAM Methodology
R Joshi, Rouwaida Kanj, S Butt, Emrah Acar, D Lea, D Sciacca
VLSI Design and 2013 12th International Conference on Embedded Systems (VLSID), 2013 26th International Conference on, pp. 344--349

Phased array millimeter wave imaging techniques
Dong G Kam, Duixian Liu, Arun S Natarajan, Scott K Reynolds, Alberto Valdes Garcia
US Patent 8,456,351


2012

2.5D and 3D technology challenges and test vehicle demonstrations
J. U. Knickerbocker, P. S. Andry, E. Colgan, B. Dang, T. Dickson, X. Gu, C. Haymes, C. Jahnes, Y. Liu, J. Maria, R. J. Polastre, C. K. Tsang, L. Turlapati, B. C. Webb, L. Wiggins, S. L. Wright
2012 IEEE 62nd Electronic Components and Technology Conference, pp. 1068-1076

Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology
Katsuyuki Sakuma, Kurt Smith, Krishna Tunga, Eric Perfecto, Thomas Wassick, Frank Pompeo, J Nah
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 430--435

Modeling of power delivery into 3D chips on silicon interposer
Z. Xu, X. Gu, M. Scheuermann, K. Rose, B. C. Webb, J. U. Knickerbocker, J. Q. Lu
2012 IEEE 62nd Electronic Components and Technology Conference, pp. 683-689

Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
Z. Xu, X. Gu, M. Scheuermann, K. Rose, B. C. Webb, J. U. Knickerbocker, J. Q. Lu
2012 IEEE 62nd Electronic Components and Technology Conference, pp. 1819-1825

Decoupling capacitor modeling and characterization for power supply noise in 3D systems
Z. Xu, C. Putnam, X. Gu, M. Scheuermann, K. Rose, B. Webb, J. Knickerbocker, J. Q. Lu
2012 SEMI Advanced Semiconductor Manufacturing Conference, pp. 414-419

A 19Gb/s Serial Link Receiver with Both 4-tap FFE and 5-tap DFE Functions in 45nm SOI CMOS
A. Agrawal, J. Bulzacchelli, T. Dickson, Y. Liu, J. Tierno, and D. Friedman
IEEE Journal of Solid-State Circuits (JSSC), 2012

Mitigating TSV-induced Substrate Noise Coupling in 3-D IC Using Buried Interface Contacts
X. Gu, J. Silberman, Y. Liu and X. Duan
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012

An 8x10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects
T. Dickson, Y. Liu, S. Rylov, B. Dang, C. Tsang, P. Andry, J. Bulzacchelli, H. Ainspan, X. Gu, L. Turlapati, M. Beakes, B. Parker, J. Knickerbocker, and D. Friedman
IEEE Journal of Solid-State Circuits (JSSC), 2012

A Compact Low-Power 3D I/O in 45nm CMOS
Y. Liu, W. Luk, and D. Friedman
IEEE International Solid-State Circuits Conference (ISSCC) , 2012

2.5D and 3D Technology Challenges and Test Vehicle Demonstrations
. Knickerbocker, P. Andry, E. Colgan, B. Dang, T. Dickson, X. Gu, C. Haymes, C. Jahnes, Y. Liu, J. Maria, R. Polastre, C. Tsang, L. Turlapati, B. Webb, L. Wiggins and S. Wright
IEEE Electronic Components and Technology Conference (ECTC), 2012

Effect of Underfill Properties on Thermomechanical Stress in Fine Pitch 3D-IC Package
Akihiro Horibe, Sayuri Kohara, Kuniaki Sueoka, Keiji Matsumoto, Yasumitsu Orii, Fumiaki Yamada (ASET)
Electronics Packaging (ICEP), 2012 International Conference on

Thermomechanical Design for Fine Pitch 3D-IC Packages
Akihiro Horibe, Sayuri Kohara, Kuniaki Sueoka, Keiji Matsumoto, Yasumitsu Orii, Fumiaki Yamada (ASET)
International Microelectronics Assembly and Packaging Society (IMAPS), 2012

Advanced Etch Technology for Nanopatterning
Y. Zhang, G. Oehrlein, Q. Lin
Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, 2012

Quantifying the elasticity and viscosity of geometrically confined polymer films via thermal wrinkling
E.P. Chan, Q. Lin, C.M. Stafford
Journal of Polymer Science Part B: Polymer Physics, Wiley Online Library, 2012

The effects of plasma exposure on low-k dielectric materials
J. L. Shohet; H. Ren; M. T. Nichols; H. Sinha; W. Lu; K. Mavrakakis; Q. Lin; N. M. Russell; M. Tomoyasu; G. A. Antonelli; S. U. Engelmann; N. C. Fuller; V. Ryan; Y. Nishi
Advanced Etch Technology for Nanopatterning, Ying Zhang, Editors, 83280I, pp. 83280I--83280I, SPIE, 2012

The effects of vacuum ultraviolet radiation on low-k dielectric films
H. Sinha, H. Ren, M. T. Nichols, J. L. Lauer, M. Tomoyasu, N. M. Russell, G. Jiang, G. A. Antonelli, N. C. Fuller, S. U. Engelmann, Q. Lin, V. Ryan, Y. Nishi, and J. L. Shohet
J. Appl. Phys. 112(11), 111101, AIP, 2012

Silicon Photonic Switches Hybrid-Integrated With CMOS Drivers
A V Rylyakov, C L Schow, B G Lee, W M J Green, S Assefa, F E Doany, M Yang, J Van Campenhout, C V Jahnes, J A Kash, Y.Vlasov
Solid-State Circuits, IEEE Journal of 47(99), 1--1, IEEE, 2012

Silicon photonic switches hybrid-integrated with CMOS drivers
A.V. Rylyakov, C.L. Schow, B.G. Lee, W.M.J. Green, S. Assefa, F.E. Doany, M. Yang, J. Van Campenhout, C.V. Jahnes, J.A. Kash, others
ISSCC 2011/SESSION 12/DESIGN IN EMERGING TECHNOLOGIES/12.4, pp. 345--354, IEEE, 2012


2011

3D Chip stacking with 50 $\mu$m pitch lead-free micro-c4 interconnections
J Maria, B Dang, SL Wright, CK Tsang, P Andry, R Polastre, Y Liu, L Wiggins, JU Knickerbocker
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 268--273

Design and modeling methodology of vertical interconnects for 3DI applications
Rachel Gordin, David Goren, Shlomo Shlafman, Danny Elad, Michael Scheuermann, Albert Young, Fei Liu, Xiaoxiong Gu, Christy Tyberg
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1(2), 163--167, IEEE, 2011

High-density silicon carrier transmission line design for chip-to-chip interconnects
X. Gu, L. Turlapati, B. Dang, C. K. Tsang, P. S. Andry, T. O. Dickson, M. P. Beakes, J. U. Knickerbocker, D. J. Friedman
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, pp. 27-30

An 8x10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects
T. Dickson, Y. Liu, S. Rylov, B. Dang, C. Tsang, P. Andry, J. Bulzacchelli, H. Ainspan, X. Gu, L. Turlapati, M. Beakes, B. Parker, J. Knickerbocker, and D. Friedman
IEEE VLSI Symposium, 2011

The zEnterprise 196 system and microprocessor
Brian W Curran, Lee E Eisen, Eric M Schwarz, Pak-kin Mak, James Warnock, Patrick J Meaney, Michael Fee
IEEE Micro 31(2), 0026--40, IEEE Computer Society, 2011

IBM zEnterprise TM energy efficient 5.2 Ghz processor chip
H. Wen, J. Warnock, Y. Chan, G. Mayer, B. Truong, T. Strach, T. Slegel, S. Carey, G. Salem, F. Malgioglio, D. Malone, D. Plass, B. Curran, Y.-H. Chan, M. Mayo, W. Huott, P. Mak
IEEE International Conference on IC Design & Technology (ICICDT), pp. 1-5, 2011

High Density 3D TSV Chip Integration Process
Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada (ASET)
Electronics Packaging (ICEP), 2011 International Conference on


Multichannel high-bandwidth coupling of ultradense silicon photonic waveguide array to standard-pitch fiber array
F.E. Doany, B.G. Lee, S. Assefa, W.M.J. Green, M. Yang, C.L. Schow, C.V. Jahnes, S. Zhang, J. Singer, V.I. Kopp, others
Lightwave Technology, Journal of 29(4), 475--482, IEEE, 2011

A 3.9 ns 8.9 mW 4$\times$ 4 silicon photonic switch hybrid integrated with CMOS driver
A. Rylyakov, C. Schow, B. Lee, W. Green, J. Van Campenhout, M. Yang, F. Doany, S. Assefa, C. Jahnes, J. Kash, others
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International, pp. 222--224

Mechanical Trapping in a Quadratically Coupled Optomechanical Double Disk
J.T. Hill, Q. Lin, J. Rosenberg, O. Painter
CLEO: Science and Innovations, 2011

Ultra-dense monolithic integration of optical and electrical functions on silicon for optical interconnects
S. Assefa, W.M.J. Green, A. Rylyakov, C. Schow, F. Horst, Y.A. Vlasov
General Assembly and Scientific Symposium, 2011 XXXth URSI, pp. 1--2

Quantifying the stress relaxation modulus of polymer thin films via thermal wrinkling
E P Chan, S Kundu, Q Lin, C M Stafford
ACS Journal, ACS Publications, 2011

Deeply-scaled CMOS-integrated nanophotonic devices for next generation supercomputers
S. Assefa, W.M.J. Green, A. Rylyakov, C. Schow, F. Horst, Y.A. Vlasov
Proceedings of the 21st Great lakes symposium on VLSI, pp. 475--476, 2011

CMOS integrated silicon nanophotonics for future exascale systems
Y.A. Vlasov
SOI Conference (SOI), 2011 IEEE International, pp. 1--35

CMOS Integrated Silicon Nanophotonics for Exascale Computing
W.M. Green, S. Assefa, A. Rylyakov, C. Schow, F. Horst, Y. Vlasov
Frontiers in Optics, 2011

Increasing bandwidth density in future optical interconnects
BG Lee, C. Baks, FE Doany, C. Jahnes, R. John, DM Kuchta, P. Pepeljugoski, AV Rylyakov, CL Schow, S. Assefa, others
Photonics Conference (PHO), 2011 IEEE, pp. 670--671

Hybrid-Integrated Germanium Photodetector and CMOS Receiver Operating at 15 Gb/s
B.G. Lee, S. Assefa, C. Schow, W.M. Green, A. Rylyakov, R.A. John, J.A. Kash, Y.A. Vlasov
CLEO: Science and Innovations, 2011

20Gbps receiver based on germanium photodetector hybrid-integrated with 90nm CMOS amplifier
S. Assefa, B.G. Lee, C. Schow, W.M. Green, A. Rylyakov, R.A. John, Y.A. Vlasov
CLEO: Applications and Technology, 2011

Demonstration of a digital CMOS driver codesigned and integrated with a broadband silicon photonic switch
B.G. Lee, C.L. Schow, A.V. Rylyakov, J. Van Campenhout, W.M.J. Green, S. Assefa, F.E. Doany, M. Yang, R.A. John, C.V. Jahnes, others
Journal of Lightwave Technology 29(8), 1136--1142, IEEE, 2011

CMOS integrated nanophotonics: Enabling technology for exascale computing systems
S. Assefa, W.M. Green, A. Rylyakov, C. Schow, F. Horst, Y. Vlasov
Optical Fiber Communication Conference, 2011

Optical technologies for data communication in large parallel systems
MB Ritter, Y. Vlasov, JA Kash, A. Benner
Journal of Instrumentation6, C01012, IOP Publishing, 2011

Technologies for exascale systems
P. W. Coteus, J. U. Knickerbocker, C. H. Lam, Y. A. Vlasov
IBM Journal of Research and Development 55(5), 14:1-14:12, 2011

Applications of SOI Technologies to Communication
J.O. Plouchart
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2011 IEEE, pp. 1--4

A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications
A. Natarajan, S.K. Reynolds, M.D. Tsai, S.T. Nicolson, J.H.C. Zhan, D.G. Kam, D. Liu, Y.L.O. Huang, A. Valdes-Garcia, B.A. Floyd
Solid-State Circuits, IEEE Journal of 46(5), 1059--1075, IEEE, 2011

LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications
D G Kam, D Liu, A Natarajan, S Reynolds, H C Chen, B A Floyd
Microwave and Wireless Components Letters, IEEE pp. 99, 1--1, IEEE, 2011

Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications
A. Valdes-Garcia, S. Reynolds, A. Natarajan, D. Kam, D. Liu, J.W. Lai, Y.L.O. Huang, P.Y. Chen, M.D. Tsai, J.H.C. Zhan, others
Communications Magazine, IEEE 49(4), 120--131, IEEE, 2011

A 3.9 ns 8.9 mW 4x4 silicon photonic switch hybrid integrated with CMOS driver
A Rylyakov, C Schow, B Lee, W Green, J Van Campenhout, M Yang, F Doany, S Assefa, C Jahnes, J Kash, others
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International, pp. 222--224

An 8x10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects
T. Dickson, Y. Liu, S. Rylov, B. Dang, C. Tsang, P. Andry, J. Bulzacchelli, H. Ainspan, X. Gu, L. Turlapati, M. Beakes, B. Parker, J. Knickerbocker, and D. Friedman
Symposium on VLSI Circuits, 2011

Low-cost antenna-in-package solutions for 60-GHz phased-array systems (invited tutorial)
D. Kam
International Microwave Symposium (IMS), 2011

A fully integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications
A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd
IEEE J. Solid-State Circuits, to be published, 2011

LTCC packages with embedded phased-array antennas for 60-GHz communications
D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd
IEEE Microwave and Wireless Components Letters, to be published, 2011

Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited)
A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd
IEEE Communications Magazine, under review, 2011


2010

Low-cost antenna-in-package solutions for 60-GHz phased-array systems
D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010

Through-Silicon Via Inductance and Capacitance Characterization
F. Liu, X. Gu, K. A. Jenkins, E. Cartier, Y. Liu, P. Song, and S. J. Koester
60th Electronic Components and Technology Conference, 2010


2009

Communication technologies for exascale systems (invited)
J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter
SPIE Photonics West, 2009

Is 25 Gb/s on-board signaling viable? (invited)
D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu
IEEE Trans. Advanced Packaging 32(2), 328--344, IEEE, 2009


2008

Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (invited)
P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks
SPIE Photonics West, 2008

The viability of 25 Gb/s onboard signaling
M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster
Electronic Components and Technology Conference (ECTC), pp. 1121--1127, 2008

Multi-level signaling in high-density, high-speed electrical links (best paper award)
D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter
IEC DesignCon, 2008