Keishi Okamoto  Keishi Okamoto photo       

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Research Staff Member, Semiconductor packaging
IBM Research - Tokyo, Kawasaki, Japan
  +81dash050dash3149dash3307dash3307

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Professional Associations

Professional Associations:  IEEE Member  |  Japan Institute of Electronics Packaging

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More information:  linkedIn


2017

Effects of build-up material properties on warpage dispersion of organic substrate caused by manufacturing variations
Keishi Okamoto, Sayuri kohara, Hiroyuki Mori
Packaging and Integration of Electronic and Photonic Microsystems (ASME InterPACK) 2017


2015

Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
Keishi Okamoto, Sayuri kohara, Hirokazu Noma, Kazushige Toriyama, Hiroyuki Mori
International Conference on Electronics Packaging(ICEP) 2015


2014

Electrical assessment of chip to chip connection for ultra high density organic interposer
Keishi Okamoto, Hiroyuki Mori, Yasumitsu Orii
International Conference on Electronics Packaging(ICEP) , 2014


2013

Electrical Capability Assessment for High Wiring Density Organic Interposer
Keishi Okamoto, Hiroyuki Mori, Yasumitsu Orii
Electrical Design of Advanced Packaging and Systems(EDAPS), 265-269, IEEE, 2013

Study of surface treatment on flip chip underfill adhesion by using Canti-Lever Beam test
Keishi Okamoto, Akihiro Horibe, Kazushige Toriyama
International Conference on Electronics Packaging(ICEP) , 2013


2012

Adhesion test for underfill delamination in flip chip package
Keishi Okamoto, Akihiro Horibe, Kazushige Toriyam
International Conference on Electronics Packaging(ICEP) , 2012


2011

Mechanical Analysis of Wafer Level Underfill Process for Advanced Flip Chip Packaging
Keishi Okamoto, Kazushige Toriyama, Keiji Matsumoto, Yasumitsu Orii
The 13th International Conference on Electronics Materials And Packaging(EMAPS), 2011


2010

Study on mechanical reliability assessment of multi terminal capacitor assembly on Multi Chip Module
K. Okamoto, S. Hayashida, S. Harada, M. Ueno
International Conference on Electronics Packaging(ICEP), 2010


2007

Material Property Modeling by Using the Thermal Deformation Measurement System
K. Okamoto, M. Kuzuno, T. Nishio
International Conference on Electronics Packaging(ICEP), 2007


2002

A technique for developing a precise thermal compact model
Keishi Okamoto, Kohji Koyamada, Masanori Kuzuno, Toshihiko Nishio, Hidetoshi Kotera
ASME Pressure Vessels and Piping Conference (PVP) , 2002