Kuniaki Sueoka  Kuniaki Sueoka photo       

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Advisory Researcher - EOP
IBM Research - Tokyo, Japan
  +81dash50dash3150dash4098

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2015

Through silicon via process for effective multi-wafer integration
Horibe, Akihiro and Sueoka, Kuniaki and Aoki, Toyohiro and Toriyama, Kazushige and Okamoto, Keishi and Kohara, Sayuri and Mori, Hiroyuki and Orii, Yasumitsu
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp. 1808--1812
Abstract

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
Sueoka, Kuniaki and Horibe, Akihiro and Aoki, Toyohiro and Kohara, K and Toriyama, Kazushige and Mori, Hiroyuki and Orii, Yasumitsu
3D Systems Integration Conference (3DIC), 2015 International, pp. TS8--3
Abstract


2014

Nanomaterials for silicon photonic packaging spin-on nanomaterials for optical packaging
Yoichi Taira, Kuniaki Sueoka, Hidetoshi Numata
Electronics Packaging (ICEP), 2014 International Conference on, pp. 703--706

Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
Yoichi Taira, Ryuma Mizusawa, Rie Matsumoto, Kuniaki Sueoka, Hidetoshi Numata
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, pp. 1870--1875

Fine-pitch solder joining for high density interconnection
Kuniaki Sueoka, Sayuri Kohara, Akihiro Horibe, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii
Electronics Packaging (ICEP), 2014 International Conference on, pp. 600--603

Bonding technologies for chip level and wafer level 3D integration
K. Sakuma, S. Skordas, J. Zitz, E. Perfecto, W. Guthrie, L. Guerin, R. Langlois, H. Liu, K. Ramachandran, W. Lin, K. Winstel, S. Kohara, K. Sueoka, M. Angyal, T. Graves-Abe, D. Berger, J. Knickerbocker, S. Iyer
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 647-654


2013

Scaling Challenges of Semiconductor Packaging in the Era of Big Data
Orii, Yasumitsu and Horibe, Akihiro and Toriyama, Kazushige and Matsumoto, Keiji and Noma, Hirokazu and Kohara, Sayuri and Aoki, Toyohiro and Sueoka, Kuniaki and Mori, Hiroyuki
International Symposium on Microelectronics, pp. 000402--000407, 2013
Abstract

Thermo-mechanical evaluation of 3D packages
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii
3D Systems Integration Conference (3DIC), 2013 IEEE International, pp. 1--4

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, others
3D Systems Integration Conference (3DIC), 2013 IEEE International, pp. 1--8

Scaling challenges of packaging in the Era of Big Data
Yasumitsu Orii, Akihiro Horibe, Kazushige Toriyma, Keiji Matsumoto, Hirokazu Noma, Sayuri Kohara, Kuniaki Sueoka, Hiroyuki Mori
VLSI Technology (VLSIT), 2013 Symposium on, pp. T40--T41

Thermal design guidelines for a three-dimensional (3D) chip stack, including cooling solutions
Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, J Takamatsu, K Kondo
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE, pp. 1--6


2012

Thermomechanical Design for Fine Pitch 3D-IC Packages
Horibe, Akihiro and Kohara, Sayuri and Sueoka, Kuniaki and Matsumoto, Keiji and Orii, Yasumitsu and Yamada, Fumiaki
International Symposium on Microelectronics, pp. 001001--001009, 2012
Abstract

Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami
3D Systems Integration Conference (3DIC), 2011 IEEE International, pp. 1--7, 2012

Thermal stress and die-warpage analyses of 3D die stacks on organic substrates
Sayuri Kohara, Kuniaki Sueoka, Akihiro Horibe, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii
CPMT Symposium Japan, 2012 2nd IEEE, pp. 1--4

Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, including the transient measurements
Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Yasumitsu Orii, Fumiaki Yamada
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, pp. 8--13


2011

TSV Diagnostics by X-ray Microscopy
Kuniaki Sueoka, Fumiaki Yamada, Akihiro Horibe, Hidekazu Kikuchi, Katsunori Minami, Yasumitsu Orii
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th, pp. 695--698

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
K Sakuma, K Toriyama, H Noma, K Sueoka, N Unami, J Mizuno, S Shoji, Y Orii
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 7--13

Development of vacuum underfill technology for a 3D chip stack
Katsuyuki Sakuma, Sayuri Kohara, Kuniaki Sueoka, Yasumitsu Orii, Mikio Kawakami, Kazuo Asai, Yoshikazu Hirayama, John U Knickerbocker
Journal of Micromechanics and Microengineering 21(3), 035024, IOP Publishing, 2011


2010

Thermal resistance evaluation of a three-dimensional (3D) chip stack
Keiji Matsumoto, Soichiro Ibaraki, Katsuyuki Sakuma, Kuniaki Sueoka, Hidekazu Kikuchi, Yasumitsu Orii, Fumiaki Yamada
Electronics Packaging Technology Conference (EPTC), 2010 12th, pp. 614--619

Thermal stress analysis of 3D die stacks with low-volume interconnections
S. Kohara, K. Sakuma, Y. Takahashi, T. Aoki, K. Sueoka, K. Matsumoto, P. S. Andry, C. K. Tsang, E. J. Sprogis, J. U. Knickerbocker, Y. Orii
2010 IEEE CPMT Symposium Japan, pp. 1-4

IMC bonding for 3D interconnection
K. Sakuma, K. Sueoka, S. Kohara, K. Matsumoto, H. Noma, T. Aoki, Y. Oyama, H. Nishiwaki, P. S. Andry, C. K. Tsang, J. U. Knickerbocker, Y. Orii
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), pp. 864-871


2008

Performance improvement of stacked graphite sheets for cooling applications
Yoichi Taira, Sayuri Kohara, Kuniaki Sueoka
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 760--764

Characterization of stacked die using die-to-wafer integration for high yield and throughput
K. Sakuma, P. S. Andry, C. K. Tsang, K. Sueoka, Y. Oyama, C. Patel, B. Dang, S. L. Wright, B. C. Webb, E. Sprogis, R. Polastre, R. Horton, J. U. Knickerbocker
2008 58th Electronic Components and Technology Conference, pp. 18-23


2003

43.1: Color Filterless Liquid Crystal Display Illuminated with LEDs
Yoichi Taira, Hidetoshi Numata, Daiju Nakano, Kuniaki Sueoka, Fumiaki Yamada, Masaru Suzuki, Michikazu Noguchi, Rama Singh, Evan G Colgan
SID Symposium Digest of Technical Papers, pp. 1250--1253, 2003


1995

Intracavity EO modulation of BBO for a cw all-solid-state deep-UV source
Yoichi Taira, Soichi Owa, Kuniaki Sueoka
Conference on Lasers and Electro-Optics, pp. CWG6, 1995


1994

Study of magnetic characteristics of tips for magnetic force microscopy
K Sueoka, F Sai, K Parker, T Arnoldussen
Journal of Vacuum Science \& Technology B 12(3), 1618--1622, AVS: Science \& Technology of Materials, Interfaces, and Processing, 1994


1993

MFM and its application to magnetic recording: for DC and high-frequency characterization
K Sueoka, K Wago, F Sai
Magnetics in Japan, IEEE Translation Journal on 8(4), 236--244, IEEE, 1993


1992

A study of MiG head readout waveform asymmetry with magnetic force and Kerr Microscopy
S Takayama, K Sueoka, H Satoh, R Schafer, BE Argyle, PL Troulliud
Magnetics Conference, 1992. Digests of Intermag'92., International, pp. 222--222

A study of MIG head readout waveform asymmetry, using magnetic force and Kerr microscopy
S Takayama, K Sueoka, H Setoh, R Schafer, BE Argyle, PL Trouilloud
Magnetics, IEEE Transactions on 28(5), 2647--2649, IEEE, 1992


Direct measurement of the sensitivity distribution of magnetoresistive heads by the SXM technique
K Sueoka, K Wago, F Sai
Magnetics, IEEE Transactions on 28(5), 2307--2309, IEEE, 1992


1991

Magnetic force microscopy of recording heads
K Wago, K Sueoka, F Sai
Magnetics, IEEE Transactions on 27(6), 5178--5180, IEEE, 1991

Study of tip magnetization behavior in magnetic force microscope
K Sueoka, K Okuda, N Matsubara, F Sai
Journal of Vacuum Science \& Technology B 9(2), 1313--1317, AVS: Science \& Technology of Materials, Interfaces, and Processing, 1991


1990

A Study on Recorded Transitions in Particulate Perpendicular Recording Media
K Sueoka, K Abkemeier, KG Ashar
Magnetics in Japan, IEEE Translation Journal on 5(3), 245--251, IEEE, 1990


1989

2-dimensional observation of recorded magnetization transitions in perpendicular recording
K Sueoka, F Sai, KG Ashar
Magnetics, IEEE Transactions on 25(5), 4162--4164, IEEE, 1989

Spacing Loss in Perpendicular Recording
K Sueoka, KG Ashar
Magnetics in Japan, IEEE Translation Journal on 4(3), 171--177, IEEE, 1989


1988

An analytical three-dimensional field model of a perpendicular recording head
K Okuda, K Sueoka, KG Ashar
Magnetics, IEEE Transactions on 24(6), 2479--2481, IEEE, 1988


1987

Direct measurement of side fringe field and two-dimensional head field using high-resolution inductive loop
O Watanuki, K Sueoka, KG Ashar
Magnetics, IEEE Transactions on 23(5), 3164--3166, IEEE, 1987