Bing Dang  Bing Dang photo       

contact information

Micro System Technology Solution, Healthcare & LifeScience
Thomas J. Watson Research Center, Yorktown Heights, NY USA
  +1dash914dash945dash1568

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Professional Associations

Professional Associations:  IEEE Components, Packaging and Manufacturing Technology Society  |  IEEE, Senior Member


2016

Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
Dang, Bing and Colgan, Evan and Yang, Fanghao and Schultz, Mark and Liu, Yang and Chen, Qianwen and Nah, Jae-Woong and Polastre, Robert and Gaynes, Michael and McVicker, Gerard and others
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 1271--1277
Abstract

Feasibility Study of Si Handler Debonding by Laser Release
Dang, Bing and Wassick, Tom and Liu, Yang and Chen, Qianwen and Andry, Paul and Hung, Li-Wen and Zhang, Hongqing and Gelorme, Jeffrey and Knickerbocker, John
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 1671--1677
Abstract


2015

Local measurements of flow boiling heat transfer on hot spots in 3D compatible radial microchannels
Yang, Fanghao and Schultz, Mark and Parida, Pritish and Colgan, Evan and Polastre, Robert and Dang, Bing and Tsang, Cornelia and Gaynes, Michael and Knickerbocker, John and Chainer, Timothy
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, pp. V003T10A006--V003T10A006
Abstract

Embedded two-phase cooling of large 3D compatible chips with radial channels
Schultz, Mark and Yang, Fanghao and Colgan, Evan and Polastre, Robert and Dang, Bing and Tsang, Cornelia and Gaynes, Michael and Parida, Pritish and Knickerbocker, John and Chainer, Timothy
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, pp. V003T10A007--V003T10A007
Abstract


2014

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Dang, Bing and Maria, Joana and Chen, Qianwen and Nah, Jae-Woong and Andry, Paul and Tsang, Cornelia and Sakuma, Katsuyuki and Tyberg, Christy and Robertazzi, Raphael and Scheuermann, Michael and others
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, pp. 1372--1377
Abstract

Factors in the selection of temporary wafer handlers for 3D/2.5 D integration
Dang, Bing and Webb, Bucknell and Tsang, Cornelia and Andry, Paul and Knickerbocker, John
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, pp. 576--581
Abstract


2013

NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50$mu$m pitch in 3D chip stacks
Dang, Bing and Wright, Steven and Maria, Joana and Tsang, Cornelia and Andry, Paul and Wiggins, Lovell and Knickerbocker, John
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 1595--1599
Abstract


2012

An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
Dickson, Timothy O and Liu, Yong and Rylov, Sergey V and Dang, Bing and Tsang, Cornelia K and Andry, Paul S and Bulzacchelli, John F and Ainspan, Herschel A and Gu, Xiaoxiong and Turlapati, Lavanya and others
IEEE Journal of Solid-State Circuits 47(4), 884--896, IEEE, 2012
Abstract


2011

High-density silicon carrier transmission line design for chip-to-chip interconnects
Gu, Xiaoxiong and Turlapati, Lavanya and Dang, Bing and Tsang, Cornelia K and Andry, Paul S and Dickson, Timothy O and Beakes, Michael P and Knickerbocker, John U and Friedman, Daniel J
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on, pp. 27--30
Abstract


2010

Integrated microfluidic cooling and interconnects for 2D and 3D chips
Dang, Bing and Bakir, Muhannad S and Sekar, Deepak Chandra and King Jr, Calvin R and Meindl, James D
IEEE Transactions on Advanced Packaging 33(1), 79--87, IEEE, 2010
Abstract

Power delivery, signaling and cooling for 2D and 3D integrated systems
Bakir, Muhannad and Huang, Gang and Dang, Bing
Coupled Data Communication Techniques for High-Performance and Low-Power Computing, pp. 13--48, Springer, 2010
Abstract

CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
Dang, Bing and Andry, Paul and Tsang, Cornelia and Maria, Joana and Polastre, Robert and Trzcinski, Robert and Prabhakar, Aparna and Knickerbocker, John
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, pp. 1393--1398
Abstract

Three-Dimensional Chip Stack With Integrated Decoupling Capacitors and Thru-Si Via Interconnects
Bing Dang; Michael Shapiro; Paul Andry; Cornelia Tsang; Edmund Sprogis; Steven Wright; Mario Interrante; Jonathan Griffith; Van Truong; Luc Guerin; Roger Liptak; Daniel Berger; John Knickerbocker
IEEE Electron Device Letters, 2010

Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips
Bing Dang; Muhannad S. Bakir; Deepak Chandra Sekar; Calvin R. King Jr; James D. Meindl
IEEE Transactions on Advanced Packaging, 2010


2009

3D chip stack with integrated decoupling capacitors
Dang, Bing and Wright, Steven L and Andry, Paul and Sprogis, Edmund and Ketkar, Supriya and Tsang, Cornelia and Polastre, Robert and Knickerbocker, John
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, pp. 1--5
Abstract


2008

Reliability testing of through-silicon vias for high-current 3D applications
Wright, Steven L and Andry, Paul S and Sprogis, Edmund and Dang, Bing and Polastre, Robert J
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 879--883
Abstract

50$mu$m pitch Pb-free micro-bumps by C4NP technology
Dang, Bing and Shih, Da-Yuan and Buchwalter, Stephen and Tsang, Cornelia and Patel, Chirag and Knickerbocker, John and Gruber, Peter and Knickerbocker, Sarah and Garant, John and Semkow, Krystyna and others
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 1505--1510
Abstract

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
Andry, Paul S and Tsang, Cornelia K and Webb, Bucknell C and Sprogis, Edmund J and Wright, Steven L and Dang, Bing and Manzer, Dennis G
IBM Journal of Research and Development 52(6), 571--581, IBM, 2008
Abstract

3D stacking of chips with electrical and microfluidic I/O interconnects
King, Calvin R and Sekar, Deepak and Bakir, Muhannad S and Dang, Bing and Pikarsky, Joel and Meindl, James D
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 1--7
Abstract

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation
Bakir, Muhannad S and King, Calvin and Sekar, Deepak and Thacker, Hiren and Dang, Bing and Huang, Gang and Naeemi, Azad and Meindl, James D
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE, pp. 663--670
Abstract

A 3D-IC technology with integrated microchannel cooling
Sekar, Deepak and King, Calvin and Dang, Bing and Spencer, Todd and Thacker, Hiren and Joseph, Paul and Bakir, Muhannad and Meindl, James
Interconnect Technology Conference, 2008. IITC 2008. International, pp. 13--15
Abstract

50$mu$m pitch Pb-free micro-bumps by C4NP technology
Dang, Bing and Shih, Da-Yuan and Buchwalter, Stephen and Tsang, Cornelia and Patel, Chirag and Knickerbocker, John and Gruber, Peter and Knickerbocker, Sarah and Garant, John and Semkow, Krystyna and others
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 1505--1510
Abstract

3D chip stacking with C4 technology
Dang, Bing and Wright, Steven L and Andry, Paul S and Sprogis, Edmund J and Tsang, Cornelia K and Interrante, M John and Webb, Bucknell C and Polastre, Robert J and Horton, Raymond R and Patel, Chirag S and others
IBM Journal of Research and Development 52(6), 599--609, IBM, 2008
Abstract

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, Katsuyuki and Andry, Paul S and Tsang, Cornelia K and Wright, Steven L and Dang, Bing and Patel, Chirag S and Webb, Bucknell C and Maria, J and Sprogis, Edmund J and Kang, SK and others
IBM Journal of Research and Development 52(6), 611--622, IBM, 2008
Abstract

Three-dimensional silicon integration
Knickerbocker, John U and Andry, Paul S and Dang, Bing and Horton, Raymond R and Interrante, Mario J and Patel, Chirag S and Polastre, Robert J and Sakuma, Katsuyuki and Sirdeshmukh, Ranjani and Sprogis, Edmund J and others
IBM Journal of Research and Development 52(6), 553--569, IBM, 2008
Abstract



2007

Electromigration resistant power delivery systems
Sekar, Deepak C and Dang, Bing and Davis, Jeffrey A and Meindl, James D
IEEE electron device letters 28(8), 767--769, IEEE, 2007
Abstract

Electrical and optical chip I/O interconnections for gigascale systems
Bakir, Muhannad S and Dang, Bing and Ogunsola, Oluwafemi Olusegun Akindeji and Sarvari, Reza and Meindl, James D
IEEE Transactions on Electron Devices 54(9), 2426--2437, IEEE, 2007
Abstract


2006

Integrated input/output interconnection and packaging for GSI
Dang, Bing
Ph.D. Thesis, 2006
Abstract

Sea-of-leads MEMS I/O interconnects for low-k IC packaging
Dang, Bing and Bakir, Muhannad S and Patel, Chirag S and Thacker, Hiren D and Meindl, James D
Journal of Microelectromechanical Systems 15(3), 523--530, IEEE, 2006
Abstract


2005

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, John U and Andry, Paul S and Buchwalter, L Paivikki and Deutsch, Alina and Horton, Raymond R and Jenkins, Keith A and Kwark, Young Hoon and McVicker, Gerald and Patel, Chirag S and Polastre, Robert J and others
IBM Journal of Research and Development 49(4.5), 725--753, IBM, 2005
Abstract

Characterization of flip chip microjoins up to 40 GHz using silicon carrier
Patel, Chirag S and Andry, Paul S and Jenkins, Keith A and Dang, Bing and Horton, Raymond and Polastre, Robert J and Tsang, Cornelia K
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International, pp. 129--131
Abstract


2004

Optimal implementation of sea of leads (SoL) compliant interconnect technology
Dang, Bing and Patel, Chirag and Thacker, Hiren and Bakir, Muhannad and Martin, Kevin and Meindl, James
Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International, pp. 99--101
Abstract


Year Unknown

IEEE Transactions on Components, Packaging and Manufacturing Technology
Johnson, R Wayne and MAHAJAN, RAVI and SCHUTT-A{'I}NE, JOSE E and RAMAKRISHNA, KONERU and CHIANG, KUO-NING and ANKIREDDI, SAI and ARIK, MEHMET and BAILEY, CHRIS and BAKIR, MUHANNAD and BASARAN, CEMAL and others
AÍNE… - ieeexplore.ieee.org, 0
Abstract