Geraud Dubois  Geraud Dubois photo       

contact information

TA to VP & Lab Director, IBM Research - Almaden
Almaden Research Center, San Jose, CA, USA
  +1dash408dash927dash1584

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Professional Associations

Professional Associations:  International Sol-Gel Society  |  Materials Research Society (MRS)

more information

More information:  Stanford Materials Science and Engineering Department


2015

Surface plasma modification of porous thin-films to optimize pore filling
Robert Bruce, Geraud Dubois, Theo Frot, Krystelle Lionti, Teddie Magbitang, Willi Volksen
US Patent 9,214,335

In situ Hardmask generation
Geraud Dubois, Theo Frot, Teddie Magbitang, Willi Volksen
US Patent 9,058,983

Overburden removal for pore fill integration approach
Bruce Robert, Dubois Geraud, Frot Theo, Volksen Willi
US Patent 8,927,430


2014

Reduction of pore fill material dewetting
Dubois Geraud, Frot Theo, Magbitang Teddie, Volksen willi
US Patent 8,871,632

Semiconductor interconnect structure having enhanced performance and reliability
Cabral Cyril, Dubois Geraud, Edelstein Daniel, Nogami Takeshi, Sanders Daniel
US Patent 8,841,770

Homogeneous modification of porous films
Dubois Geraud, Frot Theo, Volksen willi
US Patent 8,828,489

Semiconductor interconnect structure having enhanced performance and reliability
Cabral Jr Cyril, Dubois Geraud Jean-Michel, Edelstein Daniel C., Nogami Takeshi, Sanders Daniel P.
US Patent 8,648,465

Homogeneous porous low dielectric constant materials
Purushothaman Sampath, Dubois Geraud Jean-Michel, Magbitang Teddie P., Volksen Willi, Frot Theo J.
US Patent 8,623,741


2013

Poly-oxycarbosilane compositions for use in imprint lithography
Dipietro Richard Anthony, Dubois Geraud Jean-Michel, Miller Robert Dennis, Sooriyakumaran Ratnam
US Patent 8,617,786

Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials
Allen Robert David, DiPietro Richard Anthony, Dubois Geraud Jean-Michel, Hart Mark Whitney, Miller Robert Dennis, Sooriyakumaran Ratnam
US Patent 8,603,584

Reduction of pore fill material dewetting
G. Dubois, T.J. Frot, T. P. Magbitang, W. Volksen
US Patent 8,541,301

Nanoporous media with lamellar structures
Cha Jennifer, Dubois Geraud, Hedrick James, Kim Ho-Cheol, Lee Victor, Magbitang; Teddie Peregrino, Miller Robert, Volksen Willi
US Patent 8,389,589

Methods to mitigate plasma damage in organosilicate dielectrics
Arnold John; Bonilla Griselda, Cote William, Dubois geraud, Edelstein Daniel, Grill Alfred, Huag Elbert, Miller Robert, Nitta Satya, Purushothaman Sampath; Ryan Todd; Sankarapadian Muthumanickam; Spooner Terry, Volksen Willi
US Patent 8,470,706

Methods to mitigate plasma damage in organosilicate dielectrics
Arnold John; Bonilla Griselda, Cote William, Dubois geraud, Edelstein Daniel, Grill Alfred, Huag Elbert, Miller Robert, Nitta Satya, Purushothaman Sampath; Ryan Todd; Sankarapadian Muthumanickam; Spooner Terry, Volksen Willi
US Patent 8,481,423

Homogeneous porous low dielectric constant materials
Bruce Robert; Dubois Geraud; Frot Theo; Magbitang teddie; Purushothaman Sampath; Rath David; Volksen Willi
US Patent 8,492,239

Homogeneous modification of porous films
Geraud Jean-Michel Dubois, Theo J. Frot, Willi Volksen
US Patent App 20130045337

Reduction of Pore Fill Material Dewitting
G. Dubois, T.J. Frot, T.P. Magbitang, W. Volksen
US Patent 8,541,301

Protection of intermetal dielectric layers in multilevel wiring structures
Maxime Darnon, Geraud J. M. Dubois, Sebastian U. Engelmann, Teddie P. Magbitang, Sampath Purushothaman, Muthumanickam Sankarapandian, Willi Volksen
US Patent App 20130056874

Semiconductor interconnect structure having enhanced performance and reliability
Jr. Cabral Cyril, Geraud Jean-Michel Dubois, Daniel C. Edelstein, Takeshi Nogami, Daniel P. Sanders
US Patent App 20130075908

Overburden removal for pore fill integration approach
Robert L. Bruce, Geraud Jean-Michel Dubois, Theo J. Frot, Willi Volksen
US patent App 20130017682

Homogeneous Porous Low Dielectric Constant Materials
Robert L. Bruce, Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Sampath Purushothaman, David L. Rath, Willi Volksen
US Patent 8,492,239

Nanoporous Media with Lamellar Structures
J.N. Cha, G.J.M. Dubois, J.L. Hedrick, H.C. Kim, V.Y.W. Lee, T.P. Magbitang, R.D. Miller, W. Volksen
US Patent 8,389,589


2012

Composite membrane with multi-layered active layer
Radwan A Alrasheed, Blake W Davis, Jacquana T Diep, Geraud J Dubois, Young-Hye Na, Majed S Nassar, Ankit Vora
US Patent App. 13/491,506

Materials for selective trapping of carbon monoxide
Jerome Francois, Dubois Geraud, Brandes Stephane, Canard Gabriel, Barbe Jean-Michel, Guilard Roger, Roux-Fouillet Bruno, Ledon henry
US Patent 8,247,392

Nanoporous media templated from unsymmetrical amphiphilic porogens
Dubois Geraud, Hedrick James, Kim Ho-cheol, Lee Victor, Magbitang Teddie, Miller Robert, Volksen Willi
US Patent 8,268,903

Homogeneous porous low dielectric constant materials
Purushothaman Sampath, Dubois Geraud, Magbitang Teddie, Volksen Willi
US Patent 8,314,005


2011

Photopatternable dielectric materials for BEOL applications and methods for use
Allen Robert et al.
US Patent 7,919,225

Method of step-and-flash imprint lithography
Dipietro Richard et al.
US Patent 7,927,664

Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures
Dubois Geraud et al.
US Patent 7,931,829

Nanoporous media templated from unsymmetrical amphiphilic porogens
Cha Jennifer et al.
US Patent 7,960,442

Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials
Allen Robert et al.
US Patent 8,026,293

Homogeneous porous low dielectric constant materials for semiconductor apparatus
Sampath Purushothaman, Geraud Jean-Michel Dubois, Teddie P. Magbitang, Willi Volksen, Theo J. Frot

POLY-OXYCARBOSILANE COMPOSITIONS FOR USE IN IMPRINT LITHOGRAPHY
R.A. Dipietro, G.J.M. Dubois, R.D. Miller, R. Sooriyakumaran
US Patent App. 13/026,168


Method of step-and-flash imprint lithography
R.A. Dipietro, G.J.M. Dubois, R.D. Miller, R. Sooriyakumaran
US Patent 7,927,664

Photopatternable dielectric materials for BEOL applications and methods for use
R.D. Allen, P.J. Brock, B.W. Davis, G.J.M. Dubois, Q. Lin, R.D. Miller, A. Nelson, S. Purushothaman, R. Sooriyakumaran, others
US Patent 7,919,225


2010

Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures
Dubois geraud et al.
US Patent 7,820,242

Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures
G.J.M. Dubois, J.L. Hedrick, H.C. Kim, V.Y.W. Lee, T.P. Magbitang, R.D. Miller, M. Sankarapandian, L.K. Sundberg, W. Volksen, others
US Patent 7,820,242


2009

Nanoporous media with lamellar structures
Cha Jennifer et al.
US Patent 7,482,389

Methods to mitigate plasma damage in organosilicate dielectrics
John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Dubois, Daniel C. Edelstein, Alfred Grill, Elbert Huang, Robert D. Miller, Satya V. Nitta, Sampath Purushothaman, E. Todd Ryan, Muthumanickam Sankarapandian, Terry A. Spooner, Willi Volksen
US Patent 8,470,706


2008

Method of forming low-K interlevel dielectric layers and structures
Dubois Geraud et al.
US Patent 7,459,183

Imprint process using polyhedral oligomeric silsesquioxane based imprint materials
Allen Robert et al.
US Patent 7,468,330

Methods to form SiCOH or SiCNH dielectrics with improved cohesive strength and resistance to water-induced degradation and device structures including the same
Geraud Dubois, Stephen M. Gates, Alfred Grill, Victor Y. Lee, Robert D. Miller, Son Nguyen, Vishnubhai Patel

Compositions comprising polyoxycarbosilane and methods for their use in imprint lithography to give devices with dense wiring and low capacitance
Richard Anthony Dipietro, Geraud Jean-Michel Dubois, Robert Dennis Miller, Ratnam Sooriyakumaran

Imprint process using polyhedral oligomeric silsesquioxane based imprint materials
R.D. Allen, R.A. DiPietro, G.J.M. Dubois, M.W. Hart, R.D. Miller, R. Sooriyakumaran, others
US Patent 7,468,330


2007

Porous organosilicates with improved mechanical properties
Dubois Geraud et al.
US Patent 7,229,934

Dielectric materials containing resins and thermally decomposable polymer nanoparticle porogens
Geraud Jean-Michel Dubois, James Lupton Hedrick, Ho-Cheol Kim, Victor Yee-Way Lee, Teddie Peregrino Magbitang, Robert Dennis Miller, Muthumanickam Sankarapandian, Linda Karin Sundberg, Willi Volksen

Polyhedral oligomeric silsesquioxane-based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials
Robert David Allen, Richard Anthony DiPietro, Geraud Jean-Michel Dubois, Mark Whitney Hart, Robert Dennis Miller, Ratnam Sooriyakumaran

MATERIALS FOR SELECTIVE TRAPPING OF CARBON MONOXIDE
F. Jerome, G. Dubois, S. Brandes, G. Canard, J. Barbe, R. Guilard, B. Roux-fouillet, H. Ledon
EP Patent 1,414,823


2006

Nanoporous organosilicate media with lamellar structures
Jennifer Nam Cha, Geraud Jean-Michel Dubois, James Lupton Hedrick, Ho-Cheol Kim, Victor Yee-Way Lee, Teddie Peregrino Magbitang, Robert Dennis Miller, Willi Volksen

Process for preparing co-gels having polyazacycloalkane moieties and their use
R. Corriu, C. Reye, A. Mehdi, G. Dubois, C. Chuit, F. Denat, B. Roux-fouillet, R. Guilard, G. Lagrance, S. Brandes, others
EP Patent 1,325,939

Nanoporous media templated from unsymmetrical amphiphilic porogens
Jennifer Nam Cha, Geraud Jean-Michel Dubois, James Lupton Hedrick, Ho-Cheol Kim, Victor Yee-Way Lee, Teddie Peregrino Magbitang, Robert Dennis Miller, Willi Volksen

Porous organosilicates with improved mechanical properties
Geraud Dubois, James L. Hedrick, Ho-Cheol Kim, Victor Y. Lee, Teddie P. Magbitang, Robert D. Miller, Eva E. Simonyi, Willi Volksen

Methods to form SiCOH or SiCNH dielectrics and structures including the same
G. Dubois, S.M. Gates, A. Grill, V.Y. Lee, R.D. Miller, S. Nguyen, V. Patel
US Patent App. 11/481,019


2004



2003

Silica gel incorporating polyazacycloalkane units comprising more than six nitrogen atoms, preparation process and use
Denat Franck et al.
US Patent 6,534,649

Preparation of of novel corrinoid materials for selective trapping of carbon monoxide
Francois Jerome, Geraud Dubois, Stephane Brandes, Gabriel Canard, Jean-Michel Barbe, Roger Guilard, Bruno Roux-Fouillet, Henry Ledon

NOVEL MATERIALS FOR SELECTIVE TRAPPING OF CARBON MONOXIDE
F. JEROME, G. DUBOIS, S. BRANDES, G. CANARD, J.M. BARBE, R. GUILARD, B. ROUX-FOUILLET, H. LEDON
WO Patent WO/2003/011,865


SILICA GEL INCORPORATING POLYAZACYCLOALKANE STRUCTURAL UNITS
R. Corriu, C. Reye, A. Mehdi, G. Dubois, C. Chuit, F. Denat, B. Roux-fouillet, R. Guilard, G. Lagrange, S. Brandes, others
EP Patent 1,051,422


2001

Silica gels incorporating polyazacycloalkane units containing more than six nitrogen atoms, their preparation and use
Franck Denat, Geraud Dubois, Raphael Tripier, Roger Guilard, Bruno Roux-Fouillet