Lynne M. Gignac  Lynne M. Gignac photo       

contact information

TEM analysis; interconnect materials research
Thomas J. Watson Research Center, Yorktown Heights, NY USA
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links

Professional Associations

Professional Associations:  Microscopy Society of America


2014

System involving electrically reprogrammable fuses
Chanda, Kaushik and Gignac, Lynne M and Ll, Wai-Kin and Wang, Ping-Chaun
US Patent 8,866,257
Abstract

Discontinuous/non-uniform metal cap structure and process for interconnect integration
Yang, Chih-Chao and Gignac, Lynne M and Hu, Chao-Kun and Mittal, Surbhi
US Patent 8,889,546
Abstract

Discontinuous/non-uniform metal cap structure and process for interconnect integration
Yang, Chih-Chao and Gignac, Lynne M and Hu, Chao-Kun and Mittal, Surbhi
US Patent 8,823,176
Abstract

Structure and process for conductive contact integration
Yang, Chih-Chao and Gignac, Lynne M
US Patent 8,679,970
Abstract


2013

METHODS AND SYSTEMS INVOLVING ELECTRICALLY REPROGRAMMABLE FUSES
K Chanda, L M Gignac, W K Li, P C Wang
US Patent 8535991, 9/13/2013, US Patent App. 11/839,716


2012

Efficient interconnect structure for electrical fuse applications
Chih-Chao Yang, C-K Hu, Lynne Gignac
US Patent 8,133,767


2011



2008

Control of liner thickness for improving thermal cycle reliability
R G Filippi, L M Gignac, V J McGahay, C E Murray, H S Rathore, T M Shaw, P C Wang, others
US Patent 7,345,305


2007

On-chip Cu interconnection using 1 to 5 nm thick metal cap
J Bruley, R A Carruthers, L M Gignac, C K Hu, E G Liniger, S G Malhotra, S M Rossnagel
US Patent 724946, issued 7/24/2007, US PatentApp. 11/037,970


2006


Method of forming images in a scanning electron microscope
L M Gignac, C E Murray, O C Wells
US Patent 7105817, issued 9/12/2006, US Patent App. 11/037,613


2004

Diffusion barrier layer and semiconductor device containing same
S A Cohen, T J Dalton, J A Fitzsimmons, S M C Gates, L M Gignac, P C Jamison, K W Lee, S Purushothaman, D D Restaino, E Simonyi, others
US Patent 6,784,485

Method for SEM measurement of topological features
O C Wells, L M Gignac, J L Rullan, C E Murray, others
US Patent 6,768,111


2003

Method for forming interconnects on semiconductor substrates and structures formed
Andricacos, Panayotis Constantinou and Cabral Jr, Cyril and Cotte, John Michael and Gignac, Lynne and Horkans, Wilma Jean and Rodbell, Kenneth Parker
US Patent 6,570,255, issued 5/27/2003
Abstract

Process for manufacturing a contact barrier
P W DeHaven, A G Domenicucci, L M Gignac, G L Miles, P Tiwari, Y Y Wang, H S Wildman, K H Wong
US Patent 6,509,265


2002

Aluminum-based metallization exhibiting reduced electromigration and method therefor
L A Clevenger, R G Filippi, K P Rodbell, R C Iggulden, C K Hu, L M Gignac, S Weber, J P Gambino, R F Schnabel, others
US Patent 6,448,173, issued 9/10/2002

Method for producing a flat interface for a metal-silicon contact barrier film
Y Y Wang, C Cabral, A G Domenicucci, J Faltermeier, L M Gignac, C Lavoie, C M Snavely, H S Wildman, K H Wong
US Patent 6417567, issued 7/9/2002, US Patent App. 09/874,145

Method for forming uniformly thick anodized films on large substrates
P C Andricacos, R A Carruthers, S A Cohen, J M Cotte, L M Gignac, K J Stein, K T Kwietniak, S Subbanna, H S Wildman, D E Seeger, others
US Patent , 6344129, issued 2/5/2002, US Patent App. 10/270,486

Flat interface for a metal-silicon contract barrier film
A G Domenicucci, L M Gignac, Y Y Wang, H S Wildman, K H Wong, R A Carruthers, C Lavoie, J A Miller, others
US Patent 6,417,567, issued 7/9/2002

Method for plating copper conductors and devices formed
K P Rodbell, P C Andricacos, C Cabral, L M Gignac, C E Uzoh, P S Locke
US Patent 6,344,129, issued 2/5/2002, US Patent App. 10/055,134


2000

Flat interface for a metal-silicon contact barrier film
Domenicucci, Anthony G and Gignac, Lynne M and Wang, Yun-Yu and Wildman, Horatio S and Wong, Kwong Hon
US Patent 6,124,639
Abstract

Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film
Domenicucci, Anthony G and Gignac, Lynne M and Wang, Yun-Yu and Wildman, Horatio S and Wong, Kwong Hon
US Patent 6,022,801
Abstract