Sung K. Kang  Sung K. Kang photo       

contact information

Research Scientist
Thomas J. Watson Research Center, Yorktown Heights, NY USA
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2014

Effects of Sodium Citrate Concentration on the Electroless Ni-Fe Bath Stability and Deposits
Myung-Won Jung, Sung K. Kang, and Jae-Ho Lee
J. Electronic Materials 43(January), 290-298, 2014

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions
Jaewon Chang, Sung K Kang, Jae-Ho Lee, Keun-Soo Kim, Hyuck Mo Lee
Journal of Electronic Materials 43(1), 259--269, Springer, 2014

Development of electroless nickel-iron plating process for microelectronic applications
Yu Luo, Sung K Kang, Oblesh Jinka, Maurice Mason, Steven A Cordes, Lubomyr T Romankiw
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, pp. 1782--1789


2013

Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
Sung K Kang, Jaewon Chang, Jae-Ho Lee, Keun-Soo Kim, Hyuck Mo Lee
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 1018--1023

Plastic deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders
Sung K. Kang, Jaewon Chang, Jaeho Lee, Keun-Soo Kim, and Hyuck Mo Lee,
Proceedings of 63rd Electronic Components and Technology Conference (ECTC) , pp. pp.1018-1023,, IEEE, 2013

Flip-Chip Interconnections: Past, Present, and Future
Sung-Kwon Kang, Da-Yuan Shih, William E Bernier
Advanced Flip Chip Packaging, pp. 85--154, Springer, 2013


2012

Effects of Minor Alloying Additions on the Properties of Pb-free Solders and Joints
Sung K. Kang
Lead-free Solders: Materials Reliability for Electronics (ed. K.N. Subramanian), pp. 121-160, John Wiley & Son, 2012

Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
WM Chen, SK Kang, CR Kao
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 729--735

Effects of Ti addition to Sn--Ag and Sn--Cu solders
WM Chen, SK Kang, CR Kao
Journal of Alloys and Compounds520, 244--249, Elsevier, 2012


2011

Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
Sun-Kyoung Seo, Moon Gi Cho, Sung K Kang, Jaewon Chang, Hyuck Mo Lee
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 84--89


2010

Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies
Kwang-Lung Lin, Sung K Kang, Jenq-Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson
Journal of Electronic Materials 39(12), Springer, 2010



2009

The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders
Minhua Lu, Da-Yuan Shih, Paul Lauro, Sung Kang, Charles Goldsmith, Sun-Kyoung Seo
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, pp. 922--929

The Effects of Cu, Ag, Composition and Zn Doping on the Electromigration Performance of Pb-free Solders
M. Lu, D-Y Shih, Sung Kang, s.H. Chae, S.K. Seo
59th ECTC, pp. p.922, IEEE, 2009

Solder interconnect structure and method using injection molded solder
S L Buchwalter, C Feger, P A Gruber, S K Kang, P A Lauro, D Y Shih
US Patent ..., 2009 - Google Patents, Google Patents
US Patent 7,523,852

Effect of Zn doping on SnAg solder microstructure and electromigration stability
M Lu, D Y Shih, S K Kang, C Goldsmith, P Flaitz
Journal of Applied Physics106, 053509, 2009

Interfacial Reactions and Microstructures of Sn-0.7 Cu-xZn Solders with Ni-P UBM During Thermal Aging
M G Cho, S K Kang, S K Seo, D Y Shih, H M Lee
Journal of Electronic Materials 38(11), 2242--2250, Springer, 2009

The evolution of microstructure and microhardness of Sn--Ag and Sn--Cu solders during high temperature aging
Sun-Kyoung Seo, Sung K Kang, Da-Yuan Shih, Hyuck Mo Lee
Microelectronics Reliability 49(3), 288--295, Elsevier, 2009

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
M G Cho, S K Kang, S K Seo, D Y Shih, H M Lee
Journal of Materials Research24, 534--543, 2009

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
S K Seo, S K Kang, D Y Shih, H M Lee
Journal of Electronic Materials 38(2), 257--265, Springer, 2009


2008

Interconnections for flip-chip using lead-free solders and having reaction barrier layers
K E Fogel, B Ghosal, S K Kang, S Kilpatrick, P A Lauro, H A Nye III, D Shih, D S Zupanski-Nielsen, others
US Patent ..., 2008 - Google Patents, Google Patents
US Patent 7,410,833


METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY
G G Hougham, K K Srivastava, S K Kang, D Shih, B R Sundlof, J S Chey, D W Henderson, D R Di Milia, R P Ferlita, R A Carruthers, others
2008 - freepatentsonline.com

Prevention and Control of Intermetallic Alloy Inclusions
S K Kang, D Shih, Y Son
2008 - freepatentsonline.com

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
G Hougham, L P Buchwalter, S L Buchwalter, J Casey, C Feger, M Flotta, J D Gelorme, K C Hinge, A Jain, S K Kang, others
US Patent App. 12/ ..., 2008 - Google Patents, Google Patents
US Patent App. 12/247,894

C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
D. Y. Shih, B. Dang, P. Gruber, M. Lu, S. Kang, S. Buchwalter, J. Knickerbocker, E. Perfecto, J. Garant, S. Knickerbocker, K. Semkow, B. Sundlof, J. Busby, R. Weisman, K. Ruhmer, E. Hughlett
Electronic Packaging Technology High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on, pp. 1-7

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Katsuyuki Sakuma, Paul S Andry, Cornelia K Tsang, Steven L Wright, Bing Dang, Chirag S Patel, Bucknell C Webb, J Maria, Edmund J Sprogis, SK Kang, others
IBM Journal of Research and Development 52(6), 611--622, IBM, 2008

Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
SK Kang, M G Cho, D Y Shih, S K Seo, H M Lee
Electronic Components and Technology Conference, 2008, pp. 478--484

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING IMPROVED REACTION BARRIER LAYERS
L Belanger, S L Buchwalter, L P Buchwalter, A P Giri, J H Griffith, D W Henderson, S K Kang, E H Laine, C Lavoie, P A Lauro, others
2008 - freepatentsonline.com

An overview of Pb-free, flip-chip wafer-bumping technologies
S K Kang, P Gruber, D Y Shih
JOM Journal of the Minerals, Metals and Materials Society 60(6), 66--70, Springer, 2008

Undercooling and microhardness of Pb-free solders on various under bump metallurgies
M G Cho, S K Kang, H M Lee
Journal of Materials Research 23(4), 1147--1154, Pittsburgh, PA: Published for the Materials Research Society by the American Institute of Physics, c1986-, 2008


2007

3D chip stacking technology with low-volume lead-free interconnections
K Sakuma, PS Andry, B Dang, J Maria, CK Tsang, C Patel, SL Wright, B Webb, E Sprogis, SK Kang, others
2007 Proceedings 57th Electronic Components and Technology Conference, pp. 627--632

3D Chip Stacking Technology with Low-profile Pb-free Interconnects
K. Sakuma, P.Andry, B.Dang, J. Maria, C.Tsang, C.Patel, S. Wright, B. Webb, F. Springs, S.K.Kang, R. Polastre, R.Horton, J. Knickerbocker
57th ECTC, pp. 627-632, IEEE, 2007

Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process
SK Kang, M G Cho, P Lauro, D Y Shih
Electronic Components and Technology Conference, 2007, pp. 1597--1603


Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging
M G Cho, S K Kang, D Y Shih, H M Lee
Journal of Electronic Materials 36(11), 1501--1509, Springer, 2007


2006

Pb-free microjoints (50/spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization
H Gan, SL Wright, R Polastre, LP Buchwalter, R Horton, PS Andry, C Patel, C Tsang, J Knickerbocker, E Sprogis, others
Electronic Components and Technology Conference, 2006. Proceedings. 56th, pp. 6--pp

Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems
H. Gan, S. Wright, R. Polastre, L. Buchwalter, R. Horton, P. Andry, C. Patel, C.Tsang, J. Knickerbocker, E. Sprgis, A. Pavlova, S.K. Kang, K.W. Lee
56th ECTC, pp. 1210-1215, IEEE, 2006

Mechanical Reliability of Electroless Ni(P)/Pb-free Solder System
Y.C. Sohn, C. Moon, J. Yu, Y. Jee, S.K. Kang, D-Y Shih
2006 UKC, KSEA

The Influence of Low Level Doping on the Thermal Evolution of SAC Alloy Solder Joints with Cu Pad Structures
I. de Sousa, D. Henderson, I. Patry, S.K. Kang, D-Y Shih
56th ECTC, pp. 1454-1461, 2006

Multipath soldered thermal interface between a chip and its heat sink
G L Chiu, S K Kang
US Patent App. 11/502,380, 2006 - Google Patents, Google Patents
US Patent App. 11/502,380

Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
S K Kang, D Leonard, D Y Shih, L Gignac, D W Henderson, S Cho, J Yu
Journal of Electronic Materials 35(3), 479--485, Springer, 2006


2005

Recent Progress on Pb-free Electronics at IBM
S.K. Kang, D-Y Shih, P. Gruber, D. Henderson, E. Laine, M. Farooq, M. Cole
Lead-free Electronics, pp. 14-17, 2005

The Microstructure, Solidification, Mechanical Properties, and Thermal Fatigue Behavior of Lead (Pb)-free Solders and Solder Joints Used in Microelectronic Applications
SK Kang, P Lauro, DY Shih, DW Henderson, KJ Puttlitz
IBM Journal of Res. \&Dev 49(4/5), 606--620, 2005

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
SK Kang, PA Lauro, D Y Shih, DW Henderson, KJ Puttlitz
IBM Journal of Research and Development 49(4/5), 620, IBM Corp., 2005

The oxidation of lead-free Sn alloys by electrochemical reduction analysis
S Cho, J Yu, S K Kang, D Y Shih
JOM Journal of the Minerals, Metals and Materials Society 57(6), 50--52, Springer, 2005

Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni (P)/Pb-free Solder Interconnection
Y Sohn, J Yu, S K Kang, D Shih, T Lee
ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, pp. 83, 2005

Oxidation study of pure tin and its alloys via electrochemical reduction analysis
S Cho, J Yu, S K Kang, D Y Shih
Journal of Electronic Materials 34(5), 635--642, Springer, 2005


2004

Bi-Sni Sn-Sbi Sn-Cui Sn-Zni and Sn-ln Solder-Based Systems and Their Properties
Sung K Kang
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, 281, CRC Press, 2004

Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
Sung K Kang, Da-Yuan Shih, Donovan Leonard, Donald W Henderson, Timothy Gosselin, Sung-il Cho, Jin Yu, Won K Choi
Jom 56(6), 34--38, Springer, 2004

Study of spalling behavior of intermetallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
Y C Sohn, J Yu, SK Kang, D Y Shih, T Y Lee
Electronic Components and Technology Conference, 2004

Spalling behaviors of intermetallic compounds during the wetting reaction of Sn (3.5 Ag) on electroless Ni-P metallization
Y C Sohn, J Yu, SK Kang, D Y Shih, T Y Lee
Asian Green Electronics, 2004, pp. 177--181

The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
S K Kang, P Lauro, DY Shih, DW Henderson, J Bartelo, T Gosselin, SR Cain, C Goldsmith, K Puttlitz, TK Hwang, others
Materials Transactions 45(3), 695--702, THE JAPAN INSTITUTE OF METALS, 2004

Study of Spalling Behavior of Intermetallic Compounds During the Reaction Between Electroless Ni(P) and Pb-free Solders
Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, T.Y. Lee
54th ECTC, pp. 75-81, IEEE, 2004

Spalling Behaviors of Intermetallic Compounds during the Reaction of SnAg on Electroless Ni-P
Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih
International IEEE Conference on Asian Green Electronics, pp. 177, IEEE, 2004

Display fabrication using modular active devices
S L Buchwalter, E G Colgan, S K Kang, R L Wisnieff
US Patent App. 10/ ..., 2004 - Google Patents, Google Patents
US Patent App. 10/756,037

Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
SK Kang, P Lauro, D Y Shih, DW Henderson, T Gosselin, J Bartelo, SR Cain, C Goldsmith, KJ Puttlitz, T K Hwang
Electronic Components and Technology Conference, 2004

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
YC Sohn, J Yu, SK Kang, DY Shih, TY Lee
Journal of Materials Research 19(8), 2428--2436, Pittsburgh, PA: Published for the Materials Research Society by the American Institute of Physics, c1986-, 2004

Special Issue on Lead-Free Soldering in Electronics-The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
S K Kang, P Lauro, D Y Shih, D W Henderson, J Bartelo, T Gosselin, S R Cain, C Goldsmith, K Puttlitz, T K Hwang, others
Materials Transactions-JIM 45(3), 695--702, Sendai, Japan: Japan Institute of Metals, 1989-c2000., 2004

Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P
Y C Sohn, J Yu, S K Kang, D Y Shih, W K Choi
Journal of Electronic Materials 33(7), 790--795, Springer, 2004

Fluidic cooling systems and methods for electronic components
E G Colgan, F L Pompeo, G G Daves, H T Toy, B K Furman, D L Edwards, M A Gaynes, M G Farooq, S K Kang, S P Ostrander, others
US Patent App. 10/ ..., 2004 - Google Patents, Google Patents
US Patent App. 10/904,555

LEAD-FREE SOLDER AND MICROELECTRONICS-Controlling Ag3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
S K Kang, D Y Shih, D Leonard, D W Henderson, T Gosselin, S Cho, J Yu, W K Choi
JOM-Journal of the Minerals Metals and Materials Society 56(6), 34--38, [Warrendale, Pa.: The Society (TMS), c1989-, 2004

‘Bi--Sn, Sn--Sb, Sn--Cu, Sn--Zn, and Sn--In Solder Based Systems and Their Properties
SS Kang
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, 281, CRC Press, 2004

The microstructure of Sn in near-eutectic Sn--Ag--Cu alloy solder joints and its role in thermomechanical fatigue
Donald W Henderson, James J Woods, Timothy A Gosselin, Jay Bartelo, David E King, TM Korhonen, MA Korhonen, LP Lehman, EJ Cotts, Sung K Kang, others
Journal of Materials Research 19(06), 1608--1612, Cambridge Univ Press, 2004

Controlling Ag 3 Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
S K Kang, D Y Shih, D Leonard, D W Henderson, T Gosselin, S Cho, J Yu, W K Choi
JOM Journal of the Minerals, Metals and Materials Society 56(6), 34--38, Springer, 2004


2003

IBM Research Report
SK Kang, WK Choi, DY Shih, DW Henderson, T Gosselin, A Sarkhel, C Goldsmith, KJ Puttlitz
RC22717 (W0302-019), February5, 2003

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Sung K Kang, Da-Yuan Shih, NY Donald, W Henderson, Timothy Gosselin, Amit Sarkhel, NY Charles Goldsmith, Karl J Puttlitz, Won Kyoung Choi
JOM 55(6), 61--65, Springer, 2003

Method of making a lamination and surface planarization for multilayer thin film interconnect
R Q Yu, K A Kelly, C Prasad, S K Kang, S Purushothaman
US Patent ..., 2003 - Google Patents, Google Patents
US Patent 6,632,314

Study on the Reaction Mechanism Between Sn and Electroless Ni-P with Varying P Content
Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, W.K. Choi
2003 Fall Tech Symposium on Microelectronics and Packaging, pp. 88, IMAPS-Korea

Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity
B A Cook, I E Anderson, J L Harringa, S K Kang
Journal of Electronic Materials 32(12), 1384--1391, Springer, 2003

Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
SK Kang, W K Clioi, D Y Shih, DW Henderson, T Gossefin, A Sarkliel, C Goldsmith, KJ Punlitz
Electronic Components and Technology Conference, 2003, pp. 64--70

SPECIAL ISSUE ON LEAD-FREE SOLDERS AND PROCESSING ISSUES IN MICROELECTRONIC PACKAGING-Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
P Lauro, S K Kang, W K Choi, D Y Shih
Journal of Electronic Materials 32(12), 1432--1440, [Warrendale, PA, etc., Metallurgical Society of AIME, etc.], 2003

Study of the reaction mechanism between electroless Ni--P and Sn and its effect on the crystallization of Ni--P
YC Sohn, J Yu, SK Kang, WK Choi, DY Shih
Journal of materials research 18(01), 4--7, Cambridge Univ Press, 2003

Electrically conductive filled through holes
B K Appelt, J D Gelorme, S K Kang, V R Markovich, K Papathomas, S Purushothaman
US Patent App. 10/ ..., 2003 - Google Patents, Google Patents
US Patent App. 10/375,333

Thin film attachment to laminate using a dendritic interconnection
D S Farquhar, R T Galasco, S K Kang, M D Poliks, C Prasad, R Yu
US Patent ..., 2003 - Google Patents, Google Patents
US Patent 6,600,224

Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
W K Choi, S K Kang, Y C Sohn, D Y Shih
Electronic Components and Technology Conference, 2003, pp. 1190--1196

Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders
P Lauro, S K Kang, W K Choi, D Y Shih
Journal of Electronic Materials 32(12), 1432--1440, Springer, 2003

Ag 3 Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
S K Kang, D Y Shih, NY Donald, W Henderson, T Gosselin, A Sarkhel, NY Charles Goldsmith, K J Puttlitz, W K Choi
JOM Journal of the Minerals, Metals and Materials Society 55(6), 61--65, Springer, 2003


2002

Structure employing electrically conductive adhesives
S K Kang, S Purushothaman
US Patent 6,337,522, 2002 - Google Patents, Google Patents
US Patent 6,337,522

An Overview of Pb-free Solders and Soldering Technologies
S. K. Kang
WCSE/UKC 2002, KSEA

Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
SK Kang, WK Choi, DY Shih, P Lauro, DW Henderson, T Gosselin, DN Leonard
Electronic Components and Technology Conference, 2002, pp. 146--153


Interfacial reaction studies on lead (Pb)-free solder alloys
SK Kang, DY Shih, K Fogel, P Lauro, M J Yim, GG Advocate Jr, M Griffin, C Goldsmith, DW Henderson, TA Gosselin, others
IEEE Transactions on Electronics Packaging Manufacturing 25(3), 155--161, 2002

Studies of the mechanical and electrical properties of lead-free solder joints
S K Kang, W K Choi, M J Yim, D Y Shih
Journal of Electronic Materials 31(11), 1292--1303, Springer, 2002

Lead-free tin-silver-copper alloy solder composition
W K Choi, C C Goldsmith, T A Gosselin, D W Henderson, S K Kang, K J Puttlitz, D Shih
US Patent App. 10/ ..., 2002 - Google Patents, Google Patents
US Patent App. 10/078,020

Developments in lead-free solders and soldering technology
S K Kang
JOM Journal of the Minerals, Metals and Materials Society 54(6), 25--25, Springer, 2002

Ag< sub> 3 Sn plate formation in the solidification of near ternary eutectic Sn--Ag--Cu alloys
D W Henderson, T Gosselin, A Sarkhel, S K Kang, W K Choi, D Y Shih, C Goldsmith, K J Puttlitz
Journal of Materials Research 17(11), 2775--2778, Cambridge Univ Press, 2002


2001

Foreword
Sung K Kang, Hareesh Mavoori, Srinivas Chada, C Robert Kao, Ronald W Smith
Journal of Electronic Materials 30(9), 1049--1049, Springer, 2001

Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors
S Kang, H Lim, Y Chae, I Jeon, G Choi
US Patent App. 09/911,313, 2001 - Google Patents, Google Patents
US Patent App. 09/911,313

High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
J D Gelorme, S K Kang, S Purushothaman
US Patent 6,238,599, 2001 - Google Patents, Google Patents
US Patent 6,238,599

Structure, materials, and applications of ball grid array interconnections
A J Call, S A DeLaurentis, S Farooq, S K Kang, S Purushothaman, K A Stalter
US Patent ..., 2001 - Google Patents, Google Patents
US Patent 6,297,559

Structure, materials, and methods for socketable ball grid
A J Call, S A DeLaurentis, S Farooq, S K Kang, S Purushothaman, K A Stalter
US Patent ..., 2001 - Google Patents, Google Patents
US Patent 6,300,164

Tape-Automted Bonding Materials and Technologies
S.K. Kang
Encyclopedia of Materials; Science and Technology2001, 9088-93, Elsevier Science Ltd

Development of Conductive Adhesive Materials for via Fill Applications
S, K. Kang, S. Buchwalter, N. LaBianca, J. Gelorme, S. Purushothaman, K. Papathomas, M. Poliks
IEEE Trans. Comp & Packg Tech 24(6), 16, IEEE, 2001

Interfacial Reactoin Studies on Pb-free Solder Alloys
S.K. Kang, D.Y. Shih, K. Fogel, P. Lauro, M. Yim, G. Advocates, M. Griffin, C. Goldsmith, D. Henderson, T. Gosselin, D. King, J. Konrad, A. Sarkhel, K. Puttlitz
51st ECTC, pp. 448-454, IEEE, 2001

Thermomechanical fatigue behavior of selected lead-free solders
James Bartelo, Stephen R Cain, David Caletka, Krishna Darbha, Timothy Gosselin, Donald W Henderson, David King, Kevin Knadle, Amit Sarkhel, George Thiel, others
Proceedings, IPC SMEMA Council APEX, 2001

Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
S K Kang, S Purushothaman
US Patent 6,322,685, 2001 - Google Patents, Google Patents
US Patent 6,322,685

Recent progress in Pb-free solders and soldering technologies
S K Kang
JOM Journal of the Minerals, Metals and Materials Society 53(6), 16--16, Springer, 2001


2000

Thermally conducting materials and applications for microelectronic packaging
S K Kang, S Purushothaman, E E Simonyi
US Patent 6,114,413, 2000 - Google Patents, Google Patents
US Patent 6,114,413

Method of fabricating coated powder materials and their use for high conductivity paste applications
S K Kang, S Purushothaman, R S Rai
US Patent 6,059,952, 2000 - Google Patents, Google Patents
US Patent 6,059,952

Characterization of Electroplated BiSn Alloys for Condutive Adhesives
C.K. Tsang, S. Allen, S.K. Kang
Electronic Manufacturing Engineering 15(4), 1-7, MIT, 2000

Methods of forming nitride dielectric layers having reduced exposure to oxygen
S Kang, Y Koh, J Lee
US Patent 6,159,849, 2000 - Google Patents, Google Patents
US Patent 6,159,849

Characterization of electroplated bismuth-tin alloys for electrically conducting materials
S K Kang, S Buchwalter, C Tsang
Journal of Electronic Materials 29(10), 1278--1283, Springer, 2000

Development of conductive adhesive materials for via fillapplications
SK Kang, S Buchwalter, N LaBianca, J Gelorme, S Purushothaman, K Papathomas, M Poliks
Electronic Components and Technology Conference, 2000, pp. 887--891


1999

Applications of Fine Metallic Powders for Electrically Conducting Materials
Sung K. Kang
Proc of Fine, Ultrafine, and Nano Powders '99, 1999

Pb-free Solder Alloys for Flip Chip Applications
S.K. Kang, J. Horkans, P. Andricacos, R. Carruthers, J. Cotte, M. Datta, P. Gruber, J. Harper, K. Kwietniak, C.Sambucetti, L. Shi, G. Brouillette, D. Danovitch
Proc of 49th ECTC, pp. 283-288, EIA/IEEE, 1999

Dendritic powder materials for high conductivity paste applications
S K Kang, S Purushothaman, G F Walker
US Patent 5,958,590, 1999 - Google Patents, Google Patents
US Patent 5,958,590

Pb-free solder alloys for flip chip applications
SK Kang, J Horkans, PC Andricacos, RA Carruthers, J Cotte, M Datta, P Gruber, JME Harper, K Kwietniak, C Sambucetti, others
Electronic Components and Technology Conference, 1999, pp. 283--288

Method of depositing material containing Si or Ge on a Cu or Ni surface
M J Brady, C E Farrell, S K Kang, J R Marino
1999 - freepatentsonline.com

Development of lead (Pb)-free interconnection materials for microelectronics
S K Kang
Metals and Materials International 5(6), 545--549, Springer, 1999

Barrier layers for electroplated SnPb eutectic solder joints
P C Andricacos, M Datta, W J Horkans, S K Kang, K T Kwietniak
US Patent ..., 1999 - Google Patents, Google Patents
US Patent 5,937,320

Development of conducting adhesive materials for microelectronic applications
S K Kang, S Purushothaman
Journal of Electronic Materials 28(11), 1314--1318, Springer, 1999


1998

Development of Low Cost Low Temp Conductive Adhesives
Sung K. Kang, S. Purushothaman
Proc of 48th ECTC, pp. 1031, EIA/CHMT/IEEE, 1998

Development of low cost, low temperature conductive adhesives
SK Kang, S Purushothaman
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998

Methods of fabricating dendritic powder materials for high conductivity paste applications
S K Kang, S Purushothaman, G F Walker
US Patent 5,837,119, 1998 - Google Patents, Google Patents
US Patent 5,837,119

Development of high conductivity lead (Pb)-free conductingadhesives
SK Kang, RS Rai, S Purushothaman
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 21(1), 18--22, 1998

Thermocompression bonding of aluminum bumps in TAB applications
SK Kang
48th IEEE Electronic Components \& Technology Conference, 1998, pp. 1305--1310

Study of interfacial reactions between tin and copper by differential scanning calorimetry
S K Kang, S Purushothaman
Journal of Electronic Materials 27(11), 1199--1204, Springer, 1998


1997

Materials Trends in Semiconductor and Computer Industries
Sung K. Kang
Proc of 8th KSEA Northeast Regional Conference , pp. 75, KSEA NY Metro/NJ Chapter, 1997


1996

Development of high conductivity lead (Pb)-free conducting adhesives
SK Kang, R Rai, S Purushothaman
Electronic Components and Technology Conference, 1996. Proceedings., 46th, pp. 565--570

Materials for Flat Panel Display Technology
Sung K. Kang
Research Trends in New Materials, pp. 1101-17, KSEA, 1996

Development of High Conductivity Lead(Pb)-free Conducting Adhesives
S.K. Kang, R.S. Rai, S. Purushothaman,
Proc of 46th ECTC, pp. 565-570, EIA/CHMT/IEEE, 1996

Big blue goes green
Jane M Shaw, SL Buchwalter, JC Hedrick, SK Kang, LL Kosbar, JD Gelorme, DA Lewis, S Purushothaman, R Saraf, A Viehbeck
Printed Circuit Fabrication 19(11), 5, 1996

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
S K Kang, R S Rai, S Purushothaman
Journal of Electronic Materials 25(7), 1113--1120, Springer, 1996

Electrically conductive paste materials and applications
S K Kang, T O Graham, S Purushothaman, J M Roldan, R F Saraf
1996 - freepatentsonline.com


1995

New high conductivity lead (Pb)-free conducting adhesives
SK Kang, T Graham, S Purushothaman, J Roldan, R Saraf
Electronics and the Environment, 1995, pp. 177--181

Interfacial reactions with lead (Pb)-free solders
RS Rai, SK Kang, S Purushothaman
Electronic Components and Technology Conference, 1995, pp. 1197--1202


1994

Chip Level Interconnections: Wafer Bumping and Inner Lead Bonding
S.K. Kang, W.T. Chen, R.B. Hammer, F.E. Andros
Chip on Board Technologies for Multichip Modules (ed. J. Lau), pp. 186-227, Van Nostrand Reinhold, 1994

Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
S K Kang, S Purushothaman, J J Ritsko, J M Shaw, S L Shinde
US Patent ..., 1994 - Google Patents, Google Patents
US Patent 5,296,189

Lead (Pb)-free solders for electronic packaging
S K Kang, A K Sarkhel
Journal of Electronic Materials 23(8), 701--707, Springer, 1994


1993

Nickel-alloyed tin-lead eutectic solder for surface mount technology
Sung K Kang, Thomas G Ference
Journal of materials research 8(05), 1033--1040, Cambridge Univ Press, 1993

Nickel-Alloyed Tin--Lead Eutectic Solder for Surface Mount Technology
S K Kang, T G Ference
Journal of Materials Research(USA) 8(5), 1033--1040, 1993

Method of fabricating nendritic materials
P S Bindra, J J Cuomo, T P Gall, A P Ingraham, S K Kang, J Kim, P Lauro, D N Light, V R Markovich, others
US Patent ..., 1993 - Google Patents, Google Patents
US Patent 5,185,073


1992

Mechanisms of Interconnection Formation in VLSI Packaging
Sung K. Kang
The Metal Science of Joining, pp. 319-324, TMS , 1992

Gold-to-aluminum bonding for TAB applications
SK Kang
Electronic Components and Technology Conference, 1992, pp. 870--875

Lead frame plating apparatus for thermocompression bonding
S K Kang, M J Palmer, T C Reiley, R D Topa
US Patent 5,120,418, 1992 - Google Patents, Google Patents
US Patent 5,120,418

Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
M J Brady, S K Kang, P A Moskowitz, J G Ryan, T C Reiley, E G Walton, H R Bickford, M J Palmer
US Patent ..., 1992 - Google Patents, Google Patents
US Patent 5,134,460

Separable electrical connection technology
P S Bindra, J J Cuomo, T P Gall, A P Ingraham, S K Kang, J Kim, P Lauro, D N Light, V R Markovich, E F Miersch, others
US Patent ..., 1992 - Google Patents, Google Patents
US Patent 5,137,461


1991

Innwe Lead Bonding Mechanisms in TAB Technology
Sung K. Kang
Proc of 4th Electronic Materials and Processing Congress, pp. 187-192, ASM International, 1991

Electronic Packaging Technology (Lecture Note at Semiconductor Research Institute, SNU)
Sung K. Kang
Lecture Notes on Electronic Packaging Technology, SRI-SNU, 1991

Tape Structure for Controlled Solder Attachment
SK Kang, others
IBM Technical Disclosure Bulletin 33(10A), 38--39, 1991

INTERCONNECTION TECHNOLOGIES AND MATERIALS SCIENCE
WL WINTERBOTTOM, SK KANG
JOM(1989) 43(6), 8--9, Minerals, Metals \& Materials Society, 1991

Chip Temperature Responses During Inner-Lead Bonding of TAB Packages
LS Mok, SK Kang
Materials Developments in Microelectronic Packaging: Performance and Reliability; Montreal, Quebec, 193--197, ASM International, Materials Park, Ohio 44073-0002, USA, 1991

Thermocompression bonding in integrated circuit packaging
S K Kang, M J Palmer, T C Reiley, R D Topa
US Patent 5,006,917, 1991 - Google Patents, Google Patents
US Patent 5,006,917


1990

Electronic Interconnection Technology for VLSI Packaging
Sung K. Kang
Compter WorldOctober, 1990, 167-170, Computer World

MATERIALS SCIENCE OF TAPE AUTOMATED BONDING
Sung K Kang
New technology in electronic packaging: proceedings of ASM International's 3rd Electronic Materials \& Processing Congress, San Francisco, California, USA, 20-23 August 1990, pp. 43

Electronic Interconnection Technology for VLSI Packaging
Sung K. Kang
Proceedngs of Microelectronics Packaging '90 Workshop, KITE, 1990


1989

Electronic Materials and Their Applications
Sung K. Kang
KSEA Letters 18(24-27), KSEA, 1989

Methods for the Assessment of Damage in Cast Lead-Tin Solders Subjected to Accelerated Low Cycle Fatigue
B.C. Hendrix, P.L. Bretz, J.K. Tien, S.K. Kang
Conf. Proc. Microelectronics Packaging Tech: Materials and Processes, ASM International, 1989

Separable electrical connection.
J J Cuomo, S K Kang, J Kim, P Lauro, E F Miersch, J J Ritsko, G J Saxenmeyer, G F Walker
1989 - freepatentsonline.com


1988

* IBM TJ Watson Research Center, Yorktown Heights, NY** IBM, System Technology Division, Endicott, NY
SK Kang, CG Woychik
Electronic packaging materials science III: symposium held November 30-December 4, 1987, Boston, Massachusetts, USA, pp. 359, 1988

DIFFUSIONAL PROCESSES IN METALLURGICAL INTERCONNECTIONS
SK Kang, CG Woychik
Electronic packaging materials science III: symposium held November 30-December 4, 1987, Boston, Massachusetts, USA, pp. 359, 1988

Semiconductor chip including a bump structure for tape automated bonding.
M J Brady, S K Kang, P A Moskowitz, J G Ryan, T C Reiley, E G Walton, H R Bickford, M J Palmer
1988 - freepatentsonline.com


1987

Stress and Strain Controlled Low Cycle Fatigue of Pb-Sn Solder for Electronic Packaging Applications
B.C. Hendrix, J.K. Tien, S.K. Kang, and T.C. Reiley
Effects of Load and Thermal Histories on Mechnical Behavior of Materials, TMS-AIME, 1987

Stress and strain controlled low cycle fatigue of Pb-Sn solder
BC Hendrix, JK Tien, SK Kang, T Reiley, TJ IBM
Effects of load and thermal histories on mechanical behavior of materials: proceedings of a symposium sponsored by the Mechanical Metallurgy and the Phase Transformation Committees of TMS-AIME, held at the 1987 TMS-AIME Annual Meeting in Denver, Colorado,, pp. 139

Creep-fatigue interaction in eutectic lead-tin solder alloy
RC Weinbel, JK Tien, RA Pollak, SK Kang
Journal of Materials Science 22(11), 3901--3906, Springer, 1987

Characterization of INCONEL alloy MA 6000 powder
S K Kang, R C Benn
Metallurgical and Materials Transactions A 18(6), 747--752, Springer, 1987


1986

Microstructure and Mechanics Issues Affecting SMT Solder Reliability
S.K. Kang, T.C. Reiley, V. Raman, R.A. Pollak
4th Int. Microelectronics Conf, pp. 432, 1986


1985

Solder Technology for Surface Mount Components
Sung K Kang, Roger A Pollak
Proceedings of the Technical Conference, pp. 295, 1985

Powder Metallurgical Applications for New Materials Development
Sung K. Kang
Proc. Spring Workshop by the Korean Fed. of Sci & Tech Societies, KOFST, 1985

Materials ScienceandProcessing: The Foundations of Electronic Packaging
S.K. Kang and D.E. Eastman
Proc. Spring Workshop by the Korean Federation of Sci & Tech. Societies, KOFST, 1985

Microstructural development in high volume fraction gamma prime Ni-base oxide-dispersion-strengthened superalloys
S K Kang, R C Benn
Metallurgical and Materials Transactions A 16(7), 1285--1294, Springer, 1985


1984

Long-term Mechanical Behavior of Some Oxide-Dispersion-Strengthened Alloys
R.C. Benn and S.K. Kang
Proc of Fifth International Conf on Superalloys, ASM, 1984

The Microstructure of Mechanically Alloyed Aluminum Alloys
Sung K. Kang
ASM Metal Congress Proc. on New Developments in Aluminum, American Society for Metals, 1984


1983

Creep Rupture Properties of Inconel Alloy MA6000
R.F. Singer, R.C. Benn, and S. K. Kang
(eds. J.S. Benjamin, R.C Benn), IncoMAP, 1983


1982

The Mechanical Behavior of Mechanically Alloyed Al Alloys
S.K. Kang, D.L. Erich, H.F Merrick
Proc. Sym on High Strength Powder Metallurgy Aluminum , TMS-AIME, 1982


1981

The Microstructure of Mechanically Alloyed Al-4%Mg Alloy
Sung K. Kang
Proc of 39th Annual Meeting of Electron Microscopy Society of America, Electron Microscopy Society of America, 1981

Dissolution Kinetics of Nickel in Liquid Tin
Sung K. Kang
Metallurgical Transactions12B, 620-622, 1981

Improved Fatigue Strength of Rare Earth Metal Treated Axle Steel
S. K. Kang and K. V. Gow
Metallurgical Transactions12A, 907-910, 1981


1980

Growth Kinetics of Intermetallic Phases at the Liquid
S. K. Kang and V. Ramachandran
Scripta Metallurgica14, 421-424, 1980


1979

Mechanical Properties of Rare Earth Metal Treated Rail Steels
S. K. Kang and K. V. Gow
Metallurgical Transactions10A, 1800-1802, 1979


1978

Application of Fracture Mechanics Methodology to Failure Analysis in Materials
S. K. Kang and M. Ohring
Proc. of the Seminars on the Reliability of Machine Systems, Stevens Inst of Technology, 1978

An Improved Metallurgical Technique for the Study of Nonmetallic Inclusions in Steels
S. K. Kang, and K. V. Gow
Metallography11, 219-222, 1978


1977

Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors
S.K. Kang, N. Zommer, D.L. Feucht, and R.W. Heckel
IEEE Trans. on Parts, Hybrids and PackagingPHP-13, 318-321, 1977


1976

In-situ Observations of the Recrystallization Process in Single Crystal Thin Films of Gold
S. K. Kang, I.M. Bernstein, and C.L. Bauer
Scripta Metallurgica10, 693-696, 1976

Evolution of Epitaxial Boundary in Gold-Silver Thin Film Couples
S.K. Kang and I. M. Bernstein
Philosophical Magazine33, 709-714, 1976


1975

Observation de la Structure des Joint de Grains dans des Lames Minces Bicrystalline Produites par une Nouvelle Technique (in French)
F. Cosandey, S.K. Kang, et C. L. Bauer
J. de Physique36, C4-53, 1975

Structural Studies in the Region of the Soft-Soldered Joint in Silicon Power Transistors Using SEM
S. K. Kang, D. L. Feucht, and R. W. Heckel
Microstructural Science3, 511-524, 1975

Precipitation in Thin Foils of Al-4%Cu Alloy (II)
S. K. Kang and C. Laird
Acta Metallurgica23, 35-49, 1975


1974

Precipitation in Thin Foils of Al-4%Cu Alloy (I)
S. Kang and C. Laird
Acta Metallurgica22, 1481-95, 1974


Year Unknown

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections-Author Bios
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, CS Patel, BC Webb, J Maria, EJ Sprogis, SK Kang, others
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, ..., 0

Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization
H Gan, SL Wright, R Polastre, LP Buchwalter, R Horton, PS Andry, C Patel, C Tsang, J Knickerbocker, E Sprogis, others
Electronic Components and Technology Conference, 2006, pp. 1210--1215

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections-References
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, CS Patel, BC Webb, J Maria, EJ Sprogis, SK Kang, others
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, ..., 0

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications-References
SK Kang, PA Lauro, DY Shih, DW Henderson, KJ Puttlitz
SK Kang, PA Lauro, DY Shih, DW Henderson, KJ ..., 0

JULY 2002 VOLUME 25 NUMBER 3 ITEPFL (ISSN 1523-334X)
SK Kang, DY Shih, K Fogel, P Lauro, MJ Yim, GG Advocate Jr, M Griffin, C Goldsmith, DW Henderson, TA Gosselin, others
SK Kang , DY Shih, K Fogel, P Lauro, MJ Yim, GG ..., 0



Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications-Author Bios
SK Kang, PA Lauro, DY Shih, DW Henderson, KJ Puttlitz
SK Kang, PA Lauro, DY Shih, DW Henderson, KJ ..., 0