Michael R. Scheuermann  Michael R. Scheuermann photo       

contact information

High Speed Circuit Design
Thomas J. Watson Research Center, Yorktown Heights, NY USA
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Professional Associations

Professional Associations:  IEEE Member


2013

Vertical power budgeting and shifting for three-dimensional integration
Bose, Pradip and Carpenter, Gary D and Floyd, Michael S and Kursun, Eren and Restle, Phillip J and Scheuermann, Michael R
US Patent 8,516,426
Abstract

VERTICAL POWER BUDGETING AND SHIFTING FOR 3D INTEGRATION
Pradip Bose, Gary D Carpenter, Michael S Floyd, Eren Kursun, Phillip J Restle, Michael R Scheuermann
US Patent 20,130,055,185

3D inter-stratum connectivity robustness
Michael P Beakes, Shih-hsien Lo, Michael R Scheuermann, Matthew R Wordeman
US Patent 8,381,156

CONFIGURATION OF CONNECTIONS IN A 3D STACK OF INTEGRATED CIRCUITS
Michael R Scheuermann, Joel A Silberman, Matthew R Wordeman
US Patent 20,130,049,213


2010

Hindering Side-Channel Attacks in Integrated Circuits
Gary D Carpenter, Eren Kursun, Phillip J Restle, Michael R Scheuermann
US Patent App. 12/945,155

Process for managing complex pre-wired net segments in a VLSI design
Christopher J Berry, Michael A Bowen, Michael R Scheuermann, Michael H Wood
US Patent 7,681,169


2000

Gray scale etching for thin flexible interposer
Ernest Bassous, Gobinda Das, Frank Daniel Egitto, Natalie Barbara Feilchenfeld, Elizabeth F Foster, Stephen Joseph Fuerniss, James Steven Kamperman, Donald Joseph Mikalsen, Michael Roy Scheuermann, David Brian Stone, others
US Patent 6,156,484


1996

High speed silicon-based lateral junction photodetectors having recessed electrodes and thick oxide to reduce fringing fields
Ernest Bassous, Jean-Marc Halbout, Subramanian S Iyer, Rajiv V Joshi, Vijay P Kesan, Michael R Scheuermann, Massimo A Ghioni
US Patent 5,525,828


1993

Electrical signal sampling probe apparatus
Jean-marc Halbout, Mark Benjamin Ketchen, Paul Andrew Moskowitz, Michael Roy Scheuermann
EP Patent 0,324,110

Method for conditioning an organic polymeric material
Alfred Viehbeck, Stephen L Buchwalter, William A Donson, John J Glenning, Martin J Goldberg, Kurt R Grebe, Caroline A Kovac, Linda C Matthew, Walter P Pawlowski, Mark J Schadt, others
US Patent 5,242,713

Thin interface pellicle for dense arrays of electrical interconnects
Herbert P Byrnes, Jean-Marc Halbout, Michael R Scheuermann, Eugene Shapiro
US Patent 5,207,585


1989

Detachable high-speed opto-electronic sampling probe
Jean-Marc Halbout, Mark B Ketchen, Paul A Moskowitz, Michael R Scheuermann
US Patent 4,851,767