Robert L. Bruce  Robert L. Bruce photo       

contact information

Next Generation Plasma Processing
Thomas J. Watson Research Center, Yorktown Heights, NY USA

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Professional Associations

Professional Associations:  American Vacuum Society


2016

Application of cyclic fluorocarbon/argon discharges to device patterning
D. Metzler, K. Uppireddi, R.L. Bruce, H. Miyazoe, Yu Zhu, W. Price, E.S. Sikorski, Chen Li, S.U. Engelmann, E.A. Joseph, G.S. Oehrlein
Journal of Vacuum Science & Technology A (Vacuum, Surfaces, and Films) 34(1), 01B102 (8 pp.), 2016

Fluorocarbon assisted atomic layer etching of SiO 2 and Si using cyclic Ar/C 4F 8 and Ar/CHF 3 plasma
D. Metzler, Chen Li, S. Engelmann, R.L. Bruce, E.A. Joseph, G.S. Oehrlein
Journal of Vacuum Science & Technology A (Vacuum, Surfaces, and Films) 34(1), 01B101 (10 pp.), 2016


2015

Hydrodynamics of Diamond-Shaped Gradient Nanopillar Arrays for Effective DNA Trans location into Nano channels
Chao Wang, Robert L. Bruce, Elizabeth A. Duch, Jyotica V. Patel, Joshua T. Smith, Yann Astier, Benjamin H. Wunsch, Siddharth Meshram, Armand Galan, Chris Scerbo, Michael A. Pereira, Deqiang Wang, Evan G. Colgan, Qinghuang Lin, Gustavo Stolovitzky
Acs Nano 9(2), 1206-1218, 2015

Crystalline-as-deposited ALD phase change material confined PCM cell for high density storage class memory
M.B. Sky, N. Sosa, T. Masuda, W. Kim, S. Kim, A. Ray, R. Bruce, J. Gonsalves, Y. Zhu, K. Suu, C. Lam
2015 IEEE International Electron Devices Meeting (IEDM), 3.6 (4 pp.)

Resistivity of copper interconnects beyond the 7 nm node
A. Pyzyna, R. Bruce, M. Lofaro, H. Tsai, C. Witt, L. Gignac, M. Brink, M. Guillorn, G. Fritz, H. Miyazoe, D. Klaus, E. Joseph, K.P. Rodbell, C. Lavoie, D.-G. Park
2015 Symposium on VLSI Technology, T120-1

Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
Jae-Woong Nah, Y. Martin, S. Kamlapurkar, S. Engelmann, R.L. Bruce, T. Barwicz
2015 IEEE 65th Electronic Components and Technology Conference (ECTC). Proceedings, 35-40

Formation of nanometer-thick delaminated amorphous carbon layer by two-step plasma processing of methacrylate-based polymer
Dominik Metzler, Florian Weilnboeck, Sandra C. Hernandez, Scott G. Walton, Robert L. Bruce, Sebastian Engelmann, Lourdes Salamanca-Riba, Gottlieb S. Oehrlein
Journal of Vacuum Science & Technology B 33(5), 2015

Challenges of Tailoring Surface Chemistry and Plasma/Surface Interactions to Advance Atomic Layer Etching
S. U. Engelmann, R. L. Bruce, M. Nakamura, D. Metzler, S. G. Walton, E. A. Joseph
Ecs Journal of Solid State Science and Technology 4(6), N5054-N5060, 2015

A novel self-converging write scheme for 2-bits/cell phase change memory for Storage Class Memory (SCM) application
W.C. Chien, Y.H. Ho, H.Y. Cheng, M. BrightSky, C.J. Chen, C.W. Yeh, T.S. Chen, W. Kim, S. Kim, J.Y. Wu, A. Ray, R. Bruce, Y. Zhu, H.Y. Ho, H.L. Lung, C. Lam
2015 Symposium on VLSI Technology, T100-101

Novel fast-switching and high-data retention phase-change memory based on new Ga-Sb-Ge material
H.Y. Cheng, W.C. Chien, M. BrightSky, Y.H. Ho, Y. Zhu, A. Ray, R. Bruce, W. Kim, C.W. Yeh, H.L. Lung, C. Lam
2015 IEEE International Electron Devices Meeting (IEDM), 3.5 (4 pp.)

Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides
T. Barwicz, Y. Taira, S. Takenobu, N. Boyer, A. Janta-Polczynski, Y. Thibodeau, S. Kamlapurkar, S. Engelmann, H. Numata, R.L. Bruce, S. Laflamme, P. Fortier, Y.A. Vlasov
2015 Optical Fiber Communications Conference and Exhibition (OFC). Proceedings, 3 pp.


2014

High-performance CMOS-compatible self-aligned In Ga As MOSFETs with GMSAT over 2200 muS/mum at V = 0.5 V
Y. Sun, A. Majumdar, C.-W. Cheng, R.M. Martin, R.L. Bruce, J.-B. Yau, D.B. Farmer, Y. Zhu, M. Hopstaken, M.M. Frank, T. Ando, K.-T. Lee, J. Rozen, A. Basu, K.-T. Shiu, P. Kerber, D.-G. Park, V. Narayanan, R.T. Mo, D.K. Sadana, E. Leobandung
2014 IEEE International Electron Devices Meeting (IEDM), 25.3 (4 pp.)

Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma
Dominik Metzler, Robert L. Bruce, Sebastian Engelmann, Eric A. Joseph, Gottlieb S. Oehrlein
Journal of Vacuum Science & Technology a 32(2), 2014

CMOS-Compatible Self-Aligned In0.53Ga0.47As MOSFETs With Gate Lengths Down to 30 nm
Amlan Majumdar, Yanning Sun, Cheng-Wei Cheng, Young-Hee Kim, Uzma Rana, Ryan M. Martin, Robert L. Bruce, Kuen-Ting Shiu, Yu Zhu, Damon B. Farmer, Marinus Hopstaken, Eric A. Joseph, Joel P. de Souza, Martin M. Frank, Szu-Lin Cheng, Masaharu Kobayashi, Eliz
Ieee Transactions on Electron Devices 61(10), 3399-3404, 2014

Towards the integration of both ROM and RAM functions phase change memory cells on a single die for system-on-chip (SOC) applications
H.L. Lung, M. BrightSky, W.C. Chien, J.Y. Wu, S. Kim, W. Kim, H.Y. Cheng, Y. Zhu, T.Y. Wang, R. Cheek, R. Bruce, C. Lam
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2 pp.

Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
J. Bai, D. Wang, S. W. Nam, H. Peng, R. Bruce, L. Gignac, M. Brink, E. Kratschmer, S. Rossnagel, P. Waggoner, K. Reuter, C. Wang, Y. Astier, V. Balagurusamy, B. Luan, Y. Kwark, E. Joseph, M. Guillorn, S. Polonsky, A. Royyuru, S. Papa Rao, G. Stolovitzky
Nanoscale 6(15), 8900--8906, 2014


2013

200 mm wafer-scale integration of sub-20 nm sacrificial nanofluidic channels for manipulating and imaging single DNA molecules
C. Wang, S.W. Nam, J.M. Cotte, H. Peng, C.V. Jahnes, D. Wang, R. Bruce, M. Guillorn, L.M. Gignac, W.H. Advocate, C.M. Breslin, M. Brink, J. Bucchignano, E.A. Duch, A. Galan, E. Kratschmer, P.J. Litwinowicz, M.F. Lofaro, W. Price, S.M. Rossnagel, R.D. Gold
2013 IEEE International Electron Devices Meeting, 14.1 (4 pp.)

Self-aligned III-V MOSFETs: Towards a CMOS compatible and manufacturable technology solution
Y. Sun, A. Majumdar, C.-W. Cheng, Y.-H. Kim, U. Rana, R.M. Martin, R.L. Bruce, K.-T. Shiu, Y. Zhu, D. Farmer, M. Hopstaken, E.A. Joseph, J.P. de Souza, M.M. Frank, S.-L. Cheng, M. Kobayashi, E.A. Duch, D.K. Sadana, D.-G. Park, E. Leobandung
2013 IEEE International Electron Devices Meeting, 2.7 (4 pp.)

Highly selective silicon nitride etching to Si and SiO2 for a gate sidewall spacer using a CF3I/O-2/H-2 neutral beam
Daiki Nakayama, Akira Wada, Tomohiro Kubota, Robert Bruce, Ryan M. Martin, Moritz Haass, Nicholas Fuller, Seiji Samukawa
Journal of Physics D-Applied Physics 46(20), 2013

A scalable volume-confined phase change memory using physical vapor deposition
S.C. Lai, S. Kim, M. BrightSky, Y. Zhu, E. Joseph, R. Bruce, H.Y. Cheng, A. Ray, S. Raoux, J.Y. Wu, T.Y. Wang, N.S. Cortes, C.M. Lin, Y.Y. Lin, R. Cheek, E.K. Lai, M.H. Lee, H.L. Lung, C. Lam
2013 Symposium on VLSI Technology, T132-3

Advanced Plasma Etch for the 10nm node and Beyond
E. A. Joseph, S. U. Engelmann, H. Miyazoe, R. L. Bruce, M. Nakamura, T. Suzuki, M. Hoinkis, Y Zhang, GS Oehrlein, Q Lin
Advanced Etch Technology For Nanopatterning Ii8685, 2013

Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
R. L. Bruce, S. Engelmann, S. Purushothaman, W. Volksen, T. J. Frot, T. Magbitang, G. Dubois, M. Darnon
Journal of Physics D-Applied Physics 46(26), 2013

Density scaling with gate-all-around silicon nanowire MOSFETs for the 10 nm node and beyond
S. Bangsaruntip, K. Balakrishnan, S.-L. Cheng, J. Chang, M. Brink, I. Lauer, R.L. Bruce, S.U. Engelmann, A. Pyzyna, G.M. Cohen, L.M. Gignac, C.M. Breslin, J.S. Newbury, D.P. Klaus, A. Majumdar, J.W. Sleight, M.A. Guillorn
2013 IEEE International Electron Devices Meeting, 20.2 (4 pp.)


2012

Direct and quantitative evidence for buckling instability as a mechanism for roughening of polymer during plasma etching
T. -C. Lin, R. L. Bruce, G. S. Oehrlein, R. J. Phaneuf, H. -C. Kan
Applied Physics Letters 100(23), 2012

Pattern collapse mitigation strategies for EUV lithography
Dario L. Goldfarb, Robert L. Bruce, Jim J. Bucchignano, David P. Klaus, Michael A. Guillorn, Chunghsi J. Wu, PP Naulleau, OR Wood
Extreme Ultraviolet (Euv) Lithography Iii8322, 2012

Post Porosity Plasma Protection: Scaling of Efficiency with Porosity
Theo Frot, Willi Volksen, Sampath Purushothaman, Robert L. Bruce, Teddie Magbitang, Dolores C. Miller, Vaughn R. Deline, Geraud Dubois
Advanced Functional Materials 22(14), 3043-3050, 2012

Post porosity plasma protection applied to a wide range of ultra low-k materials
T. Frot, W. Volksen, T. Magbitang, L. Krupp, P. Rice, S. Purushothaman, M. Lofaro, S. Cohen, R.L. Bruce, G. Dubois
2012 IEEE International Interconnect Technology Conference - IITC, 3 pp.

Patterning of CMOS Device Structures for 40-80nm Pitches and Beyond
S. U. Engelmann, R. Martin, R. L. Bruce, H. Miyazoe, N. C. M. Fuller, W. S. Graham, E. M. Sikorski, M. Glodde, M. Brink, H. Tsai, J. Bucchignano, D. Klaus, E. Kratschmer, M. A. Guillorn, Y Zhang, G Oehrlein, Q Lin
Advanced Etch Technology For Nanopatterning8328, 2012


2011

Characterization and mechanism of He plasma pretreatment of nanoscale polymer masks for improved pattern transfer fidelity
F. Weilnboeck, D. Metzler, N. Kumar, G. S. Oehrlein, R. L. Bruce, S. Engelmann, N. Fuller
Applied Physics Letters 99(26), 2011

A 0.021 mum trigate SRAM cell with aggressively scaled gate and contact pitch
M.A. Guillorn, J. Chang, A. Pyzyna, S. Engelmann, M. Glodde, E. Joseph, R. Bruce, J.A. Ott, A. Majumdar, F. Liu, M. Brink, S. Bangsaruntip, M. Khater, S. Mauer, I. Lauer, C. Lavoie, Z. Zhang, J. Newbury, E. Kratschmer, D.P. Klaus, J. Bucchignano, B. To, W
2011 IEEE Symposium on VLSI Technology. Digest of Technical Papers, 64-5

Application of the Protection/Deprotection Strategy to the Science of Porous Materials
Theo Frot, Willi Volksen, Sampath Purushothaman, Robert Bruce, Geraud Dubois
Advanced Materials 23(25), 2828-+, 2011

Post Porosity Plasma Protection a new approach to integrate k les 2.2 porous ULK materials
T. Frot, W. Volksen, T. Magbitang, D. Miller, S. Purushothaman, M. Lofaro, R. Bruce, G. Dubois
Joint 2011 IEEE International Interconnect Technology Conference (IITC) & 2011 Materials for Advanced Metallization (MAM), 3 pp.

Ion and Vacuum Ultraviolet Photon Beam Effects in 193 nm Photoresist Surface Roughening: The Role of the Adamantyl Pendant Group
Ting-Ying Chung, David B. Graves, Florian Weilnboeck, Robert L. Bruce, Gottlieb S. Oehrlein, Mingqi Li, Eric A. Hudson
Plasma Processes and Polymers 8(11), 1068-1079, 2011

On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists
R. L. Bruce, F. Weilnboeck, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson, A. Alizadeh
Journal of Vacuum Science & Technology B 29(4), 2011


2010

Photoresist modifications by plasma vacuum ultraviolet radiation: The role of polymer structure and plasma chemistry
F. Weilnboeck, R. L. Bruce, S. Engelmann, G. S. Oehrlein, D. Nest, T. -Y. Chung, D. Graves, M. Li, D. Wang, C. Andes, E. A. Hudson
Journal of Vacuum Science & Technology B 28(5), 993-1004, 2010

Role of polymer structure and ceiling temperature in polymer roughening and degradation during plasma processing: a beam system study of P4MS and P alpha MS
D. Nest, T-Y Chung, J. J. Vegh, D. B. Graves, R. L. Bruce, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson
Journal of Physics D-Applied Physics 43(8), 2010

Electron, ion and vacuum ultraviolet photon effects in 193 nm photoresist surface roughening
T-Y Chung, D. Nest, D. B. Graves, F. Weilnboeck, R. L. Bruce, G. S. Oehrlein, D. Wang, M. Li, E. A. Hudson
Journal of Physics D-Applied Physics 43(27), 2010

Relationship between nanoscale roughness and ion-damaged layer in argon plasma exposed polystyrene films
R. L. Bruce, F. Weilnboeck, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson, J. J. Vegh, D. Nest, D. B. Graves
Journal of Applied Physics 107(8), 2010

Molecular structure effects on dry etching behavior of Si-containing resists in oxygen plasma
R. L. Bruce, T. Lin, R. J. Phaneuf, G. S. Oehrlein, W. Bell, B. Long, C. G. Willson
Journal of Vacuum Science & Technology B 28(4), 751-757, 2010


2009

Real-time studies of surface roughness development and reticulation mechanism of advanced photoresist materials during plasma processing
A. R. Pal, R. L. Bruce, F. Weilnboeck, S. Engelmann, T. Lin, M. -S. Kuo, R. Phaneuf, G. S. Oehrlein
Journal of Applied Physics 105(1), 2009

Understanding the Roughening and Degradation of 193 nm Photoresist during Plasma Processing: Synergistic Roles of Vacuum Ultraviolet Radiation and Ion Bombardment
Dustin Nest, Ting-Ying Chung, David B. Graves, Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Deyan Wang, Cecily Andes, Eric A. Hudson
Plasma Processes and Polymers 6(10), 649-657, 2009

Dependence of Polymer Surface Roughening Rate on Deposited Energy Density During Plasma Processing
Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Dustin Nest, David B. Graves, Cecily Andes, Eric A. Hudson
Plasma Processes and Polymers 6(8), 484-489, 2009

Dependence of photoresist surface modifications during plasma-based pattern transfer on choice of feedgas composition: Comparison of C(4)F(8)- and CF(4)-based discharges
S. Engelmann, R. L. Bruce, F. Weilnboeck, M. Sumiya, T. Kwon, R. Phaneuf, G. S. Oehrlein, C. Andes, D. Graves, D. Nest, E. A. Hudson
Journal of Vacuum Science & Technology B 27(3), 1165-1179, 2009

Plasma-surface interactions of advanced photoresists with C(4)F(8)/Ar discharges: Plasma parameter dependencies
S. Engelmann, R. L. Bruce, M. Sumiya, T. Kwon, R. Phaneuf, G. S. Oehrlein, C. Andes, D. Graves, D. Nest, E. A. Hudson
Journal of Vacuum Science & Technology B 27(1), 92-106, 2009

Study of ion and vacuum ultraviolet-induced effects on styrene- and ester-based polymers exposed to argon plasma
R. L. Bruce, S. Engelmann, T. Lin, T. Kwon, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson, J. J. Vegh, D. Nest, D. B. Graves, A. Alizadeh
Journal of Vacuum Science & Technology B 27(3), 1142-1155, 2009


2008

Molecular dynamics simulations of near-surface modification of polystyrene: Bombardment with Ar(+) and Ar(+)/radical chemistries
J. J. Vegh, D. Nest, D. B. Graves, R. Bruce, S. Engelmann, T. Kwon, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson
Journal of Applied Physics 104(3), 2008

Study of 193 nm photoresist degradation during short time fluorocarbon plasma exposures. II. Plasma parameter trends for photoresist degradation
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(5), 1647-1653, 2008

Study of 193 nm photoresist degradation during short time fluorocarbon plasma exposure. I. Studies of modified layer formation
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(5), 1637-1646, 2008

Study of 193 nm photoresist degradation during short time fluorocarbon plasma exposure III. Effect of fluorocarbon film and initial surface condition on photoresist degradation
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(6), 1978-1986, 2008

Synergistic effects of vacuum ultraviolet radiation, ion bombardment, and heating in 193 nm photoresist roughening and degradation
D. Nest, D. B. Graves, S. Engelmann, R. L. Bruce, F. Weilnboeck, G. S. Oehrlein, C. Andes, E. A. Hudson
Applied Physics Letters 92(15), 2008


2007

Near-surface modification of polystyrene by Ar(+): Molecular dynamics simulations and experimental validation
J. J. Vegh, D. Nest, D. B. Graves, R. Bruce, S. Engelmann, T. Kwon, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson
Applied Physics Letters 91(23), 2007

Plasma-surface interactions of model polymers for advanced photoresists using C(4)F(8)/Ar discharges and energetic ion beams
S. Engelmann, R. L. Bruce, T. Kwon, R. Phaneuf, G. S. Oehrlein, Y. C. Bae, C. Andes, D. Graves, D. Nest, E. A. Hudson, P. Lazzeri, E. Lacob, M. Anderle
Journal of Vacuum Science & Technology B 25(4), 1353-1364, 2007


2006

Development of a dielectric-loaded accelerator test facility based on an X-band magnicon amplifier
S.H. Gold, A.K. Kinkead, W. Gai, J.G. Power, R. Konecny, C. Jing, S.G. Tantawi, C.D. Nantista, Y. Hu, X. Du, C. Tang, Y. Lhi, R.W. Bruce, R.L. Bruce, A.W. Fliflet, III Lewis D.
AIP Conference Proceedings pp. 807, 407, 2006


2005

Millimeter-wave sintering of polycrystalline ceramic laser materials
M Lombardi, AW Fliflet, D Lewis, RW Bruce, JS Choi, RL Bruce, M Kahn, S Foster, IEEE
IRMMW-THz2005: The Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electronics, Vols 1 and 2, 231-232

Microwave and millimeter-wave processing of materials
III Lewis D., R.W. Bruce, A.W. Fliflet, M.A. Imam, L.K. Kurihara, R.L. Bruce
Materials Science Forum, 2739-44, 2005

Materials processing for space applications using a gyrotron-based millimeter-wave system
RW Bruce, MT Lombardi, RL Bruce, AW Fliflet, S Foster, AK Kinkead, IEEE
IRMMW-THz2005: The Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electronics, Vols 1 and 2, 32-33

Joining of ceramic tubes using a high-power 83-GHz millimeter-wave beam
RW Bruce, RL Bruce, AW Fliflet, M Kahn, SH Gold, AK Kinkead, D Lewis, MA Imam
Ieee Transactions on Plasma Science 33(2), 668-678, 2005


2004

Development of a 20 MeV dielectric-loaded accelerator test facility
SH Gold, AK Kinkead, W Gai, JG Power, R Konecny, CG Jing, SG Tantawi, CD Nantista, Y Hu, H Chen, C Tang, Y Lin, RW Bruce, RL Bruce, AW Fliflet, D Lewis, V Yakimenko
Advanced Accelerator Concepts737, 281-287, 2004

Modeling the millimeter-wave beam joining of ceramic tubes
A.W. Fliflet, R.W. Bruce, III Lewis D., R.L. Bruce, S.H. Gold
IEEE Conference Record - Abstracts. 31st IEEE International Conference On Plasma Science (IEEE Cat. No.04CH37537), 130, 2004

High-powered 83-GHz millimeter-wave beam sintering and heat treating of engineered ceramics in controlled atmospheres
J.S. Choi, R.W. Bruce, III Lewis D., R.L. Bruce, A.K. Kinkead, A.W. Fliflet, M.A. Imam
IEEE Conference Record - Abstracts. 31st IEEE International Conference On Plasma Science (IEEE Cat. No.04CH37537), 129, 2004


2002

Polymer-derived SiC /SiC composite fabrication and microwave joining for fusion energy applications
R.L. Bruce, S.K. Guharay, F. Mako, W. Sherwood, E. Lara-Curzio
Proceedings of the 19th IEEE/IPSS Symposium on Fusion Engineering. 19th SOFE (Cat. No.02CH37231), 426-9, 2002




Projects and Groups