Thomas Brunschwiler  Thomas Brunschwiler photo       

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Zurich Research Laboratory, Zurich, Switzerland
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Professional Associations

Professional Associations:  IEEE


2014

(Invited) Wafer-Level Integration of Embedded Cooling Approaches
Stephan Paredes, Yassir Madhour, Gerd Schlottig, Chin Lee Ong, Thomas Brunschwiler
ECS Transactions 64(5), 253-265, The Electrochemical Society, 2014

Invited: Wafer-Level Integration of Embedded Cooling Approaches
Stephan Paredes, Yassir Madhour, Gerd Schlottig, Chin Lee Ong, Thomas Brunschwiler
Meeting Abstracts, pp. 1738--1738, 2014

Thermo-mechanical properties of underfills at partial and full filler percolation-sub-layering the underfill
Gerd Schlottig, Marie Haupt, Severin Zimmermann, Jonas Zuercher, Thomas Brunschwiler
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on, pp. 1-7

Study of the compound of properties of percolating and neck-based thermal underfills
Thomas Brunschwiler, Florian Schindler-Saefkow, Rachel Gordin, Marie Haupt, Gerd Schlottig
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on, pp. 227--234

Laminate with Thermal-Power Insert for Efficient Front-Side Heat Removal and Power Delivery
Dominic Gschwend, Timo Tick, Stefano Oggioni, Stephan Paredes, Keiji Matsumoto, Manish K Tiwari, Dimos Poulikakos, Thomas Brunschwiler
Integrated Power Systems (CIPS), 2014 8th International Conference on, pp. 1--6

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V Goicochea, Jonas Zuercher, Heiko Wolf
Journal of Electronic Packaging 136(4), 041012, American Society of Mechanical Engineers, 2014


2013

Computational modeling of vortex shedding in water cooling of 3D integrated electronics
Fabio Alfieri, Manish K Tiwari, Adrian Renfer, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Fluid Flow44, 745-755, Elsevier, 2013

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits
Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Thome
Proceedings of the International Conference on Computer-Aided Design, pp. 256--263, 2013

Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
Ningkang Li, Gerd Schlottig, Marco De-Fazio, Chander Shekhar Sharma, Manish Tiwari, Roberto Brioschi, Dimos Poulikakos, Thomas Brunschwiler
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on, pp. 224--230

Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
Adrian Renfer, Manish K Tiwari, Rashmita Tiwari, Fabio Alfieri, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer65, 33-43, Elsevier, 2013

Roadmap towards ultimately-efficient zeta-scale datacenters
P. Ruch, T. Brunschwiler, S. Paredes, G. I. Meijer, B. Michel
Conference on Design, Automation and Test in Europe, pp. 1339--1344, 2013

Investigation of novel solder patterns for power delivery and heat removal support
Thomas Brunschwiler, Yassir Madhour, Timo Tick, Gerd Schlottig, Stefano Oggioni
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 417--424

3D-ICE: A compact thermal model for early-stage design of liquid-cooled ics
Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler
2013 - ieeexplore.ieee.org, IEEE

Integration of intra chip stack fluidic cooling using thin-layer solder bonding
Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel
3D Systems Integration Conference (3DIC), 2013 IEEE International, pp. 1--8

Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
Gerd Schlottig, Florian Schindler-Saefkow, Jonas Zurcher, Bruno Michel, Thomas Brunschwiler
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, pp. 560-564

Vortex shedding from confined micropin arrays
Adrian Renfer, Manish K Tiwari, Ferdinand Meyer, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Microfluidics and Nanofluidics 15(2), 231-242, Springer, 2013


2012

Cloud Computing
Olivier Brian, Thomas Brunschwiler, Heinz Dill, Hanspeter Christ, Babak Falsafi, Markus Fischer, Stella Gatziu Grivas, Claudio Giovanoli, Roger Eric Gisi, Reto Gutmann, others
White Paper SATW, 2012

Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 574--587

On the significance of developing boundary layers in integrated water cooled 3D chip stacks
Fabio Alfieri, Manish K Tiwari, Igor Zinovik, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer 55(19), 5222--5232, Elsevier, 2012

Formulation of percolating thermal underfills using hierarchical self-assembly of micro-and nanoparticles by centrifugal forces and capillary bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V Goicochea, Jonas Zuercher, Heiko Wolf
J. Microelectron. Electron. Packag 9(4), 149--159, 2012

Directed Self-Assembly of Nanoparticles for Novel Electrical Interconnects
Yu Liu, Gerd Schlottig, Heiko Wolf, Georgios A. Sotiriou, and Thomas Brunschwiler
ICEPT conference, pp. 1--7, 2012

Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
Javier V Goicochea, Thomas Brunschwiler, Jonas Zuercher, Heiko Wolf, Keiji Matsumoto, Bruno Michel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 1234--1241

Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
M. K. Tiwari, S. Zimmermann, C. S. Sharma, F. Alfieri, A. Renfer, T. Brunschwiler, G. I. Meijer, B. Michel, D. Poulikakos
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 545--551, 2012

A multivariate parameter analysis of copper pillars eases the design of denser interconnects
Gerd Schlottig, Thomas Brunschwiler, Javier Goicochea, Werner Escher, Bruno Michel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on, pp. 1--6

Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
Yassir Madhour, Thomas Brunschwiler, Mario El Kazzi, John Richard Thome, Bruno Michel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp. 68--73

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications
Jonas Zuercher, Javier V Goicochea, Keiji Matsumoto, Bruno Michel, Thomas Brunschwiler
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-6


2011

Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
M M Sabry, A K Coskun, D Atienza, T S Rosing, T Brunschwiler
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on 30(12), 1883--1896, IEEE, 2011

Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
F Sun, Y Leblebici, T Brunschwiler
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 1153--1159

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
Adrian Renfer, Manish K Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Experiments in fluids 51(3), 731--741, Springer, 2011

On the cooling of electronics with nanofluids
W Escher, T Brunschwiler, N Shalkevich, A Shalkevich, T Burgi, B Michel, D Poulikakos
Journal of heat transfer 133(5), 051401, American Society of Mechanical Engineers, 2011

Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55(5), 15:1--13, IBM, 2011

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling
Mohamed M Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, Sylwia Szczukiewicz, Navid Borhani, John Richard Thome, Thomas Brunschwiler, Bruno Michel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011, pp. 1-6

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 116--124


2010

Direct waste heat utilization from liquid-cooled supercomputers
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Heat Transfer Conference, pp. 429--440, 2010

3D integrated water cooling of a composite multilayer stack of chips
Fabio Alfieri, Manish K Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Journal of Heat Transfer 132(12), 121402, American Society of Mechanical Engineers, 2010

Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
W Escher, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132(8), 081402, American Society of Mechanical Engineers, 2010

Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
G Toral, R Bender, Y Leblebici, T Brunschwiler
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, pp. 1--10

Zero-emission datacenters and 3D chip stacking
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Conference on Thermal Issues in Emerging Technologies Theory and Applications, pp. 3--3, 2010

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
R Wälchli, T Brunschwiler, B Michel, D Poulikakos
International Journal of Heat and Mass Transfer 53(5), 1004-1014, Elsevier, 2010

Heat-removal performance scaling of interlayer cooled chip stacks
T. Brunschwiler, S. Paredes, U. Drechsler, B. Michel, W. Cesar, Y. Leblebici, B. Wunderle, H. Reichl
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1, 2010

Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics
R Wälchli, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132(5), 051401, American Society of Mechanical Engineers, 2010

Compact Transient Thermal Model for 3D ICs with Liquid Cooling via Enhanced Heat Transfer Cavity Geometries
A S A V M Ruggiero, T Brunschwiler, D Atienza
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, pp. 1--6

Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Ayse Kivilcim Coskun, David Atienza, Tajana Simunic Rosing, Thomas Brunschwiler, Bruno Michel
Design, Automation & Test in Europe Conference & Exhibition, pp. 111-116, 2010

3d-ice: Fast compact transient thermal modeling for 3d ics with inter-tier liquid cooling
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
Proceedings of the International Conference on Computer-Aided Design, pp. 463--470, 2010


2009

Antenna coupled far-infrared/THz detector in CMOS
T. Morf, J. Weiss, L. Kull, H. Rothuizen, T. Toifl, M. Kossel, C. Menolfi, G. von Bueren, T. Brunschwiler, M. Schmatz
Electronics Letters 45(25), 1321-1323, IET, 2009

Validation of the Porous-medium Approach to Model Interlayer-cooled 3D-chip Stacks
Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W Cesar, G Toral, Yuksel Temiz, Yusuf Leblebici
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--10

Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156


Toward zero-emission data centers through direct reuse of thermal energy
Thomas Brunschwiler, Brian Smith, E Ruetsche, Bruno Michel
IBM Journal of Research and Development 53(3), 11, IBM, 2009

Interlayer cooling potential in vertically integrated packages
T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl
Microsystem Technologies 15(1), 57-74, Springer, 2009


2008

Thermal management of vertically integrated packages
Thomas Brunschwiler, Bruno Michel
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, 635--649, Wiley Online Library, 2008

Design of thermal interfaces with embedded microchannels to control bond line formation
Brian Smith, Hugo Rothuizen, Ryan Linderman, Thomas Brunschwiler, Bruno Michel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, pp. 410--418

Radially oscillating flow hybrid cooling system for low profile electronics applications
R Walchli, R Linderman, T Brunschwiler, U Kloter, H Rothuizen, N Bieri, D Poulikakos, B Michel
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, pp. 142--148

Forced convective interlayer cooling in vertically integrated packages
Thomas Brunschwiler, B Michel, Hugo Rothuizen, U Kloter, B Wunderle, H Oppermann, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, pp. 1114--1125


2007

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
T. Brunschwiler, U. Kloter, R.J. Linderman, H. Rothuizen, B. Michel
Components and Packaging Technologies, IEEE Transactions on 30(2), 226--234, IEEE, 2007

Utility of transient testing to characterize thermal interface materials
B Smith, T Brunschwiler, B Michel
Thermal Investigation of ICs and Systems, 2007, pp. 6--11

High-performance thermal interface technology overview
R Linderman, T Brunschwiler, B Smith, B Michel
Thermal Investigation of ICs and Systems, 2007, pp. 129--134

Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
RJ Linderman, T Brunschwiler, U Kloter, H Toy, B Michel
Semiconductor Thermal Measurement and Management Symposium, 2007, pp. 87--94


2006

Microchip cooling module based on FC72 slot jet arrays without cross-flow
M. Fabbri, A. Wetter, B. Mayer, T. Brunschwiler, B. Michel, H. Rothuizen, R. Linderman, U. Kloter
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE, pp. 54--58

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture
Thomas Brunschwiler, Hugo Rothuizen, Matteo Fabbri, Urs Kloter, Bruno Michel, RJ Bezama, Govindarajan Natarajan
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM'06. The Tenth Intersociety Conference on, pp. 196--203


2005

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]
T. Brunschwiler, U. Kloter, R. Linderman, H. Rothuizen, B. Michel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, pp. 31--38


2004

Polarization-independent thermooptic phase shifters in silicon-oxynitride waveguides
B.J. Offrein, D. Jubin, T. Koster, T. Brunschwiler, F. Horst, D. Wiesmann, G. I. Meijer, M. Sousa Petit, D. Webb, R. Germann
Photonics Technology Letters 16, 1483, 2004

Hysteretic electroluminescence in organic light-emitting diodes for spin injection
G. Salis, SF Alvarado, M. Tschudy, T. Brunschwiler, R. Allenspach
Physical Review B 70(8), 085203, APS, 2004