Thomas Brunschwiler  Thomas Brunschwiler photo       

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Zurich Research Laboratory, Zurich, Switzerland
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Professional Associations

Professional Associations:  IEEE


2013

Manufacturing a filling of a gap in semiconductor devices
Thomas Brunschwiler, Javier V Goicochea, Heiko Wolf
US Patent 8,586,411

Manufacturing an underfill in a semiconductor chip package
Thomas J Brunschwiler, Javier V Goicochea, Stefano S Oggioni, Gerd Schlottig
US Patent App. 13/943,998

Chip stack structures that implement two-phase cooling with radial flow
Thomas J Brunschwiler, Evan G Colgan, John U Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K Tsang
US Patent App. 14/015,063

Thermal power plane for integrated circuits
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,427,833

Optimized semiconductor packaging in a three-dimensional stack
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,476,112

Disassemblable electronic assembly with leak-inhibiting coolant capillaries
Thomas J Brunschwiler, Evan G Colgan, Michael J Ellsworth Jr, Werner Escher, Ingmar Meijer, Stephen Paredes, Gerd Schlottig, Jeffrey A Zitz
US Patent App. 13/743,642

Integrated circuit stack
Thomas J Brunschwiler, Ryan J Linderman, Bruno Michel, Hugo E Rothuizen
US Patent 8,363,402


2012

Manufacturing a filling of a gap region
Thomas J Brunschwiler, Javier V Goicochea, Heiko Wolf
US Patent App. 13/602,388

Optimizing Heat Transfer in 3-D Chip-Stacks
Thomas Brunschwiler, Eren Kursun, Gary W Maier
US Patent App. 13/494,047

Bridging arrangement and method for manufacturing a bridging arrangement
Thomas J Brunschwiler, Javier V Goicochea, Cyrill Kuemin, Walter H Riess, Heiko Wolf
US Patent App. 13/438,254

Integrated device with defined heat flow
Thomas Brunschwiler, Jens Hofrichter
US Patent App. 13/352,151

Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
Thomas J Brunschwiler, Evan G Colgan, Michael J Ellsworth Jr, Werner Escher, G Ingmar Meijer, Stephan Paredes, Gerd Schlottig, Martin Witzig, Jeffrey A Zitz
US Patent App. 13/616,337

Adsorption heat exchanger devices
Thomas J Brunschwiler, Javier V Goicochea, Bruno Michel, Patrick Ruch
US Patent App. 14/128,822



2011

Integrated circuit package connected to a data transmission medium
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/312,327

Transferring heat through an optical layer of integrated circuitry
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/010,184

Integrated circuit package connected to an optical data transmission medium using a coolant
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/312,583



COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET
T. Brunschwiler, R.J. Linderman, H.E. Rothuizen, R. Waelchli
EP Patent 2,326,903




2009

INTEGRATED CIRCUIT STACK AND ITS THERMAL MANAGEMENT
T.J. BRUNSCHWILER, R.J. LINDERMAN, B. MICHEL, H.E. ROTHUIZEN
WO Patent WO/2009/037,648

Semiconductor chip assembly with flexible metal cantilevers
Thomas J Brunschwiler, Urs Kloter, Ryan J Linderman, Bruno Michel, Hugo E Rothuizen
US Patent 7,532,475


PATTERNED STRUCTURE FOR A THERMAL INTERFACE
B. Michel, T.J. Brunschwiler, H.E. Rothuizen, U. Kloter
US Patent App. 12/538,797



2008

COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
M. Bruno, T. Brunschwiler, U. Kloter, R.J. Linderman, E. Ruetsche
US Patent App. 12/194,973

METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT
T.J. Brunschwiler, U. Koter, R.J. Linderman, B. Michel, H.E. Rothuizen, R. Waelchli
US Patent App. 12/676,398


2007


Thermal interface with a patterned structure
T.J. Brunschwiler, U. Kloter, R.J. Linderman, B. Michel, H.E. Rothuizen
US Patent 7,282,799

Stress release thermal interfaces
Bruno Michel, Thomas J Brunschwiler, Ryan J Linderman, Hugo E Rothuizen, Urs Kloter
US Patent 20,070,230,133


2006

Heat spreader
T.J. Brunschwiler, U. Kloter, R.J. Linderman, B. Michel, H.E. Rothuizen
US Patent App. 11/476,516

Cooling device
T.J. Brunschwiler, U. Kloter, R.J. Linderman, B. Michel, H.E. Rothuizen
US Patent App. 11/598,497