Project Name

Electrical I/O Subsystems and Packaging


The high-speed electrical I/O subsystems and packaging team is exploring state-of-the-art interconnect and packaging solutions to support IBM computing systems and communication technologies. Our primary researches are focused on developing novel simulation, modeling, and measurement techniques for current and future server and supercomputer packaging needs, including cables, board, cards, multi-chip modules, single chip carriers, and on-chip interconnections.