IBM at Semicon West 2025

The global computing demands are growing significantly, driven by AI advancement and widespread AI applications expected. The demand for the next gen chips with more computing speed, lighter weight, and less energy consumption is clear. At the same time, the required investment to develop a single next-gen chip is doubling every two years, not to mention significant investment for production facilities.

How can the semicon industry sync with market needs, and user companies’ product roadmaps? How do we secure resilient supply chain? The global study captures global view on the topic.

Speaker: Noriko Suzuki, IBM

Artificial Intelligence is rapidly transforming the semiconductor industry, influencing every stage from design to manufacturing. This panel explores how AI is reshaping semiconductor infrastructure and design, focusing on its impact on chip development, manufacturing processes, and the broader ecosystem. Experts will discuss the integration of AI in optimizing chip performance, enhancing energy efficiency, and addressing the growing demands of data centers and power semiconductors. The session will also cover the challenges faced by semiconductor equipment suppliers in adapting to these technological advancements. Join us for an insightful discussion on how AI is not just a tool but a catalyst driving the next wave of innovation in the semiconductor industry.

Panelists:

• Laura Matz, Chief Science and Technology Officer, Merck KGaA,
• Mukesh Khare, General Manager IBM Semiconductors & Vice President Hybrid Cloud, IBM Research
• Mark Dougherty, President, Tokyo Electron America & TEL Manufacturing and Engineering of America
• Angada Sachid, Senior Director and Senior Executive Technologist ASM

Panel Moderator:

• David Anderson, President, NY Creates

Session: CEO Summit Keynotes

Speaker: Jennifer Lynn, IBM

Session: Secure together: Building Cybersecurity Resilience Through Industry Alliances

Despite ominous predictions of "the end of scaling", or "the end of Moore's law", The innovation space in semiconductor architecture has simultaneously broadened and accelerated in the era of AI. Not only are new transistor architectures and materials innovations finding renewed interest, but new and disruptive innovations in advanced packaging and chiplet technology are being adopted at a cadence not seen before. Across this spectrum, multiple new enabling lithography technologies like High NA EUV, new mask absorber materials, and multiple applications requiring field-stitching are ready to help accelerate technology adoption. However, there are growing challenges related to entry cost, market fragmentation, and proposed new form factors that must all be systematically addressed. In this talk, we will identify the relationship between the technology and cost challenges in the scaling roadmap, especially as they relate to high-performance computing, and the economic challenges of development, deployment and capitalization of advanced technologies to an ever-evolving customer base.

Speaker: Nelson Felix, IBM

Session: TechTALKS - Manufacturing Process Innovations to Accelerate the AI Era