Copper interconnect: Fabrication and reliability
C.-K. Hu, J.M.E. Harper
VLSI-TSA 1997
25-nm-wide lines and spaces have been fabricated in 22.5-nm-thick films of PdAu (40: 60) using electron-beam exposure and polymethylmethacrylate (PMMA) resist. A high-resolution scanning transmission electron microscopy (STEM) was used to expose the resist and the samples were mounted on 60-nm-thick Si 3N4 membrane substrates. Previously, the smallest metal structures formed with a resist process were 60 nm wide with spaces between the lines several times larger than the lines. The results presented here show that 25-nm lines can be fabricated with a center to center spacing of 50 nm.
C.-K. Hu, J.M.E. Harper
VLSI-TSA 1997
W. Molzen, Michael G. Rosenfield, et al.
Proceedings of SPIE 1989
A.S. Özcan, K.F. Ludwig Jr., et al.
Journal of Applied Physics
C.W. Chu, J.M.E. Harper, et al.
Physical Review Letters