Duixian Liu, Xiaoxiong Gu, et al.
ECTC 2023
This paper presents the design of a ball grid array package and more importantly describes the integration of a microstrip grid array antenna in the package in a low temperature cofired ceramic (LTCC) technology for a single-chip 60-GHz receiver. The grid array package has a small volume of 13.5 × 8 × 1.265 mm3 and can house a 60-GHz receiver die of current size. The package samples were fabricated and measured. The package part demonstrates low insertion loss < 0.08 dB and excellent matching with return loss > 22 dB below 5 GHz; while the antenna part achieves good matching (|S11| ≤ -10 dB), high efficiency $(η > 88%), and directional patterns with the main beam in the boresight direction from 57 to 64 GHz as well as high gain with the peak value of 14.5 dBi at 60 GHz. © 2006 IEEE.
Duixian Liu, Xiaoxiong Gu, et al.
ECTC 2023
Xiaoxiong Gu, Duixian Liu, et al.
ECTC 2015
Brian A. Floyd, Alberto Valdes-Garcia, et al.
VLSI-TSA 2010
Duixian Liu, Xiaoxiong Gu, et al.
IEEE Trans Antennas Propag