Conference paper
Stacked devices for SEU immune design
Phil Oldiges, Kenneth P. Rodbell, et al.
IEEE International SOI Conference 2010
This paper presents upset rates of flip-flops in 65 nm commercial bulk technology predicted through modeling, and compares the predictions to upset rates measured with thorium foil, 15 MeV carbon ions, and 148 MeV protons. This paper demonstrates that 15 MeV carbon ions can be used to emulate the daughter products of neutron spallation reactions. © 2006 IEEE.
Phil Oldiges, Kenneth P. Rodbell, et al.
IEEE International SOI Conference 2010
David F. Heidel, Kenneth P. Rodbell, et al.
IEEE TNS
David F. Heidel, Kenneth P. Rodbell, et al.
IEEE TNS
Kenneth P. Rodbell, David F. Heidel, et al.
IEEE TNS