Philip J. Coane, Kaolin G. Chiong, et al.
Microlithography 1993
A BiCMOS technology has been developed that integrates a high-performance self-aligned double-polysilicon bipolar device into an advanced 0.25-μm CMOS process. The process sequence has been tailored to allow maximum flexibility in the bipolar device design without perturbation of the CMOS device parameters. Thus n-p-n cutoff frequencies as high as 60 GHz were achieved while maintaining a CMOS ring oscillator delay per stage of about 54 ps at 2.5-V supply, comparable to the performance in the CMOS-only technology. BiCMOS and BiNMOS circuits were also fabricated. BiNMOS circuits exhibited ≈ 45% delay improvement compared to CMOS-only circuits under high load conditions at 2.5 V. © 1992 IEEE
Philip J. Coane, Kaolin G. Chiong, et al.
Microlithography 1993
Bijan Davari, Robert H. Dennard, et al.
Proceedings of the IEEE
John D. Cressler, James Warnock, et al.
IEEE Electron Device Letters
Tze-Chiang Chen, Kai-Yap Toh, et al.
IEEE Electron Device Letters