A.E. Ruehli
DAC 1973
A growing need exists for electrical interconnect analysis (EIA) for chips, packages and printed circuit boards. In this short tutorial we review key issues regarding EIA for VLSI parasitic circuits. We give a general introduction of important aspects for technologies with different performances and then we review some issues of concern for state of the art high performance chips and packages.
A.E. Ruehli
DAC 1973
J.D. Morsey, K. Coperich, et al.
EPTC 2000
I.M. Elfadel, A. Dounavis, et al.
IEEE Topical Meeting EPEPS 2002
A.E. Ruehli, E. Chiprout
IEEE Topical Meeting EPEPS 1995