Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
The use of a dedicated chamber to perform pre-epi deposition cleaning allows native oxide removal with a low thermal budget, and significantly improves throughput of low-temperature Si and SiGe applications. Wafers processed in the cleaning chamber show no detectable contaminants, and the cleansed surface is actually significantly smoother because of cleaning down to a sub-angstrom level.
Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
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MRS Spring Meeting 1993