J.H. Stathis, S. Zafar
Microelectronics Reliability
Experimental evidence is presented showing that the thickness dependence observed for charge-to-breakdown measurements of very thin oxide layers in metal-oxide-semiconductor structures is correlated with that for the reduction in total generated microscopic defects necessary to induce destruction. These results are related to a percolation model for the formation of paths connecting some of these defects from the cathode to the anode at the time of breakdown. © 1997 American Institute of Physics.
J.H. Stathis, S. Zafar
Microelectronics Reliability
D.J. DiMaria, F.J. Feigl, et al.
Physical Review B
C. Falcony, D.J. DiMaria, et al.
Journal of Applied Physics
D.J. DiMaria, J.H. Stathis
Journal of Applied Physics