E. Burstein
Ferroelectrics
Dendrites can be suppressed by an alternative CMP clean process. 12-hour lag time between plating and furnace anneal can also suppress formation of dendrites. In manufacturing, 12 hours of lag time between plating and anneal is impacting cycle time. Above results indicates that optimizing Cu metallization including annealing, plating, and CMP is very important to suppress the formation of dendrites.
E. Burstein
Ferroelectrics
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics
Biancun Xie, Madhavan Swaminathan, et al.
EMC 2011
Ronald Troutman
Synthetic Metals