PaperCleavable epoxy resins: Design for disassembly of a thermosetStephen L. Buchwalter, Laura L. KosbarJ Polym Sci Part A
PaperThe Complementary Redox Properties of Viologens and Pyromellitimides: A New Class of Organic ConductorsStephen L. Buchwalter, Revathi Iyengar, et al.JACS
PaperEffects of mechanical stress and moisture on packaging interfacesStephen L. Buchwalter, Peter J. Brofman, et al.IBM J. Res. Dev
PaperDevelopment of conductive adhesive materials for via fill applicationsSung K. Kang, Stephen L. Buchwalter, et al.Proceedings - Electronic Components and Technology Conference