Physical Review Letters

Paper

01 Jul 1985

Interaction of helium with a corrugated surface

View publication

Abstract

A Comment on the Letter by Y. Takada and W. Kohn, Phys. Rev. Lett. 54, 470 (1985). © 1985 The American Physical Society.

Related

Paper

Schottky barriers and semiconductor band structures

J. Tersoff

Physical Review B

Paper

Negative-curvature fullerene analog of C60

David Vanderbilt, J. Tersoff

Physical Review Letters

Paper

Alloy decomposition during growth due to mobility differences

P. Venezuela, J. Tersoff

Physical Review B - CMMP

Paper

Chemically induced grain boundary migration in doped polycrystalline silicon films

K.N. Tu, J. Tersoff, et al.

Solid State Communications

View all publications