Conference paper
Thermal analysis of multi-layer functional 3D logic stacks
Michael Scheuermann, Shurong Tian, et al.
3DIC 2016
An efficient loop-based interconnect modeling methodology is proposed for multi-GHz clock network design. High frequency effects, including inductance and proximity effects are captured. The results are validated through comparisons with electromagnetic simulations and measured data taken from a Power4 chip.
Michael Scheuermann, Shurong Tian, et al.
3DIC 2016
Pierce Chuang, Christos Vezyrtzis, et al.
ISSCC 2017
Phillip Restle
Applied Physics Letters
Joshua Friedrich, Hung Le, et al.
ICICDT 2014