Modeling polarization for Hyper-NA lithography tools and masks
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
A low-cost, fully-integrated antenna-in-package solution for 60 GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached transmitter or receiver IC. The packages have been implemented using low temperature co-fired ceramic technology. 60 GHz interconnects, including flip-chip transitions and via structures, are optimized using full-wave simulation. Anechoic chamber measurement has shown ∼ 5mm dBi unit antenna gain across all four IEEE 802.15.3c channels, achieving excellent model-to-hardware correlation. The packaged transmitter and receiver ICs, mounted on evaluation boards, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s. © 2010 IEEE.
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Eloisa Bentivegna
Big Data 2022
H.D. Dulman, R.H. Pantell, et al.
Physical Review B
J.V. Harzer, B. Hillebrands, et al.
Journal of Magnetism and Magnetic Materials