O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
Using a simple optical technique, we have measured the change in surface stress of Si(001) during the adsorption of a monolayer of arsenic and during the epitaxial growth of germanium with arsenic as a surfactant. Tensile surface stress increases nearly linearly with arsenic coverage until it attains a value of 1400 ± 100 dyn/cm at a full monolayer. During germanium deposition on an arsenic terminated surface, (compressive) surface stress increases at a rate of -1270 dyn/cm per ML (monolayer) between 3 and 8 or 9 ML, the known critical film thickness for defect formation; the stress per monolayer found above 10 ML is substantially smaller. © 1994.
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
Frank R. Libsch, Takatoshi Tsujimura
Active Matrix Liquid Crystal Displays Technology and Applications 1997
Sung Ho Kim, Oun-Ho Park, et al.
Small
G. Will, N. Masciocchi, et al.
Zeitschrift fur Kristallographie - New Crystal Structures