Israel Cidon, Leonidas Georgiadis, et al.
IEEE/ACM Transactions on Networking
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.
Israel Cidon, Leonidas Georgiadis, et al.
IEEE/ACM Transactions on Networking
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990
Yigal Hoffner, Simon Field, et al.
EDOC 2004
Thomas M. Cheng
IT Professional