Conference paper
Effects of BEOL stack on thermal mechanical stress of Cu lines
Seung-Hyun Rhee, Conal E. Murray, et al.
MRS Spring Meeting 2006
Novel techniques have been applied to model realistic alpha particle source distributions in complex back-end-of-the-line geometries. Rigorous Monte Carlo simulations with high resolution have been performed to analyze the charge collection in 45 nm SOI test devices. These studies reveal soft fail sensitivity to the topologies of the alpha particle source and the BEOL structure. © 2009 IEEE.
Seung-Hyun Rhee, Conal E. Murray, et al.
MRS Spring Meeting 2006
Conal E. Murray
ADMETA 2010
Conal E. Murray, S. Polvino, et al.
Powder Diffraction
Michael S. Gordon, Kenneth P. Rodbell, et al.
IEEE TNS