Ronald Troutman
Synthetic Metals
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
Ronald Troutman
Synthetic Metals
Fernando Marianno, Wang Zhou, et al.
INFORMS 2021
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ACS Nano
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020