Ronald Troutman
Synthetic Metals
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
Ronald Troutman
Synthetic Metals
Thomas E. Karis, C. Mark Seymour, et al.
Rheologica Acta
Revanth Kodoru, Atanu Saha, et al.
arXiv
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000