Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
To elucidate the role of chemical interactions in the promotion of metal–polymer adhesion, a poly(ethylene terephalate)/copper system was studied. Surface photografting of unsaturated monomers containing different chemical functional groups onto a three‐mil poly(ethylene terephthalate) film provided a means of examining a variety of copper‐polymer interfaces. Initial graft verification was accomplished via contact angle measurements. Adhesion strengths to vacuum‐deposited copper were determined using 90° peel tests. Graft analysis, as well as investigation of the interfacial interaction between copper and the grafted moieties, was accomplished using X‐ray photoelectron spectroscopy. Copyright © 1989 John Wiley & Sons, Inc.
Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008