Integration of optical I/O with organic chip packages
Bert J. Offrein, Christoph Bergen, et al.
SPIE Photonics Europe 2008
To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.
Bert J. Offrein, Christoph Bergen, et al.
SPIE Photonics Europe 2008
Elger A. Vlieg, Lucas Talandier, et al.
Applied Sciences
Stefan Abel, Folkert Horst, et al.
OECC/PSC 2019
Elger A. Vlieg, Roger Dangel, et al.
PSC 2021