Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperSelf-assembling materials for lithographic patterning: Overview, status and moving forwardWilliam Hinsberg, Joy Cheng, et al.SPIE Advanced Lithography 2010
PaperESR and optical absorption of bound-small polarons in YAlO3O.F. Schirmer, K.W. Blazey, et al.Physical Review B
