Fengnian Xia, Martin O'Boyle, et al.
OFC 2007
We demonstrate a mobile measurement technology which allows for fast and systematic 3-D temperature mapping of data centers. This technology yields the first experimental 3-D temperature images of an actual data center. The experimental temperature distributions reveal strong hot spots in the data center suggesting that current cooling schemes can be readily improved. © 2008 IEEE.
Fengnian Xia, Martin O'Boyle, et al.
OFC 2007
Fengnian Xia, Martin O'Boyle, et al.
OFC/NFOEC 2007
Yasuo Amemiya, Hendrik Hamann, et al.
ASME Electronic and Photonics Packaging Division 2007
Hendrik F. Hamann, Alan Weger, et al.
IEEE Journal of Solid-State Circuits