Very high performance 50 nm CMOS at low temperature
S.J. Wind, L.T. Shi, et al.
IEDM 1999
An innovative and simple method, based on electron-beam (e-beam) overlapping and overexposure techniques, is developed to fabricate sub-10 nm electrode gaps with very good electrical properties. Gaps with 4 to 10 nm spacing can be fabricated using a proper e-beam dose and pattern-developing time. The fabrication yield is nearly 100% for 8-9 nm gaps, but significantly smaller for 3-4 nm gaps. The gap leakage resistance is around 10 12-1013, implying very good isolation. As an example, we present a transport study on a single 8 nm Co particle junction using a 10 nm gap. © 2002 American Institute of Physics.
S.J. Wind, L.T. Shi, et al.
IEDM 1999
G.M. Wallraff, D. Medeiros, et al.
Microlithography 2005
Yanning Sun, E.W. Kiewra, et al.
ICICDT 2009
Ph. Avouris, T. Hertel, et al.
Applied Surface Science