Evaluation of Cu wiring in a production 64 Mb DRAM
W. Cote, G. Costrini, et al.
VLSI Technology 1998
Decomposition of SiO2 films on Si(100) during ultrahigh-vacuum anneal has been shown previously to be preceded, at low anneal temperatures, by electrical defect creation in metal-oxide-semiconductor structures. In this letter, the presence of stacking faults in a Si substrate is shown to be related to enhanced oxide decomposition during high-temperature anneal. Decomposition is enhanced because of the creation of a larger number of nucleation centers for the formation of volatile SiO. These nucleation centers are the result of the metals gettered in the stacking faults close to the SiO2/Si interface.
W. Cote, G. Costrini, et al.
VLSI Technology 1998
M. Liehr, P.A. Thiry, et al.
JVSTA
K. Hofmann, G.W. Rubloff, et al.
Applied Surface Science
J. Beintner, Y. Li, et al.
IEEE Electron Device Letters