Conference paper
Impact of back bias on ultra-thin body and BOX (UTBB) devices
Q. Liu, Frederic Monsieur, et al.
VLSI Technology 2011
Limitations of conventional strain engineering methods for fully-depleted SOI structure are reviewed and methods to extend these approaches to future FDSOI devices are discussed. The application of global strain engineering combined with biaxial to uniaxial strain conversion is shown to be promising. Finally, methods to utilize oxidation-induced strain engineering are introduced. ©The Electrochemical Society.
Q. Liu, Frederic Monsieur, et al.
VLSI Technology 2011
Dimitri A. Antoniadis, Ali Khakifirooz
IEDM 2008
Ali Khakifirooz, Kangguo Cheng, et al.
IEEE Electron Device Letters
A. Khakifirooz, Kangguo Cheng, et al.
VLSI-TSA 2010