Dipanjan Gope, Albert E. Ruehli, et al.
IEEE T-MTT
Paper
Thermal dry process soldering
Abstract
The use of nonflammable and nontoxic gases CF4, CF2C12, and SF6 for the reflow and bonding of Pb/Sn solder has been demonstrated. It has been found that a concentration of these gases on the order of l%~5% in a 760 Torr atmosphere of nitrogen or argon is sufficient for soldering. © 1986, American Vacuum Society. All rights reserved.
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