Thomas Brunschwiler, Raúl Mroßko, et al.
ESTC 2016
Novel heat removal and power delivery topologies are required to enable 'extreme 3D integration' with cube-sized compute nodes. Therefore, a technology roadmap is presented supporting memory-on-logic and logic-on-logic in the medium and long-term, by (i) dual-side cooling and integrated voltage regulators, and (ii) interlayer cooling and electrochemical power delivery.
Thomas Brunschwiler, Raúl Mroßko, et al.
ESTC 2016
Jonas Zürcher, Luca Del Carro, et al.
ECTC 2016
Rui Hu, Bruno Michel, et al.
Future Internet
Niccolò Mora, Ferdinando Grossi, et al.
Sensors (Switzerland)