Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Advanced interconnect technologies in the era of cognitive computing

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Pan Pacific 2016

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Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process

Chinami Marushima, Toyohiro Aoki, et al.

ICEP 2021

Conference paper

Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

Toyohiro Aoki, Takashi Hisada, et al.

ICEP 2016

Conference paper

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration

Kuniaki Sueoka, Akihiro Horibe, et al.

3DIC 2015

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