Publications

9 results for Arvind Kumar

Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- - Mukta Farooq
  - Arvind Kumar
  - et al.
- 2022
- ECTC 2022
Lowerature wafer bonding for three-dimensional wafer-scale integration
- - Zhe Wan
  - Kevin Winstel
  - et al.
- 2018
- S3S 2018
System Performance: From Enterprise to AI
- - Arvind Kumar
  - Leland Chang
  - et al.
- 2018
- IEDM 2018
Machine intelligence through 3D waferscale integration
- - Arvind Kumar
  - Winfried W. Wilcke
- 2017
- S3S 2017
Toward human-scale brain computing using 3D wafer scale integration
- - Arvind Kumar
  - Zhe Wan
  - et al.
- 2017
- ACM JETC
Nanotechnology requirements and challenges for large-scale brain computing
- - Arvind Kumar
- 2016
- NANO 2016
Essential edge protection techniques for successful multi-wafer stacking
- - Joshua Rubin
  - Kevin Winstel
  - et al.
- 2015
- S3S 2015
A novel ALD SiBCN low-k spacer for parasitic capacitance reduction in FinFETs
- - Tenko Yamashita
  - S. Mehta
  - et al.
- 2015
- VLSI Technology 2015
High performance 14nm SOI FinFET CMOS technology with 0.0174μm² embedded DRAM and 15 levels of Cu metallization
- - C.-H.C-H. Lin
  - Brian Greene
  - et al.
- 2014
- IEDM 2014