A BKM by Analytical TEM to Effectively Characterize Electromigration Voids versus Grain Orientations in the Integration and Evaluation of Subtractive Ru BEOL Interconnect
- Wayne Zhao
- Yu Zhu
- et al.
- 2025
- M&M 2025
Publications
2 results for Wayne Zhao
Advanced Multi-Vt Enabled by Selective Layer Reductions for 2nm Nanosheet Technology and Beyond
- Ruqiang Bao
- Yusuke Oniki
- et al.
- 2024
- IEDM 2024