Publications

79 results for John Knickerbocker

Technologies for exascale systems
- - Paul Coteus
  - John Knickerbocker
  - et al.
- 2011
- IBM J. Res. Dev
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011
Electromagnetic-SPICE modeling and analysis of 3D power network
- - Zheng Xu
  - Jian-Qiang Lu
  - et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- - Paul Andry
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- - Joana Maria
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Development of vacuum underfill technology for a 3D chip stack
- - Katsuyuki Sakuma
  - Sayuri Kohara
  - et al.
- 2011
- JMM
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- - Bing Dang
  - Michael Shapiro
  - et al.
- 2010
- IEEE Electron Device Letters
Novel adhesive development for CMOS-compatible thin wafer handling
- - K. Tamura
  - K. Nakada
  - et al.
- 2010
- ECTC 2010
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010