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Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliabilityMukta FarooqGiuseppe La Rosaet al.2015IRPS 2015
A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)Ernest Y. WuJames Stathiset al.2015IRPS 2015
Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applicationsC. KothandaramanX. Chenet al.2015IRPS 2015