Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2015
- InterPACK 2015
Publications
13 results at InterPACK 2015
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Validation study for VOF simulations of boiling in a microchannel
- Catherine Gorle
- Hyoungsoon Lee
- et al.
- 2015
- InterPACK 2015