High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- Takeshi Nogami
- Tibor Bolom
- et al.
- 2010
- IEDM 2010
Publications
14 results at IEDM 2010
Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- K.N. Chen
- T.M. Shaw
- et al.
- 2010
- IEDM 2010
Wafer scale fabrication of carbon nanotube FETs with embedded poly-gates
- Shu-Jen Han
- Josephine Chang
- et al.
- 2010
- IEDM 2010
High on-off ratio bilayer graphene complementary field effect transistors
- Kausik Majumdar
- Kota V. R. M. Murali
- et al.
- 2010
- IEDM 2010