Pierre Bonami  Pierre Bonami photo         

contact information

Software Scientist - CPLEX Optimizer


Professional Associations

Professional Associations:  COIN-OR  |  Mathematical Optimization Society



I am working for IBM as part of the research and development team of the CPLEX Optimizer. I am author or co-author of more than 20 papers in top refereed journals and conferences in Mathematical Optimization (Math. Programming, Operations Research, IPCO, SODA, INFORMS Journal on computing, ...). I am the project manager of the open source solver Bonmin (www.coin-or.org/Bonmin), and associate editor of EJCO.

Research interests

  • Mixed Integer Optimization
  • Mixed Integer Nonlinear Optimization
  • Cutting plane techniques
  • Exact Methods
  • Software for Optimization

Prizes and awards

  • 2017: IBM Analytics CrushIT Award
  • 2015: Outstanding Technical Achievement, IBM.
  • 2014: Outstanding Technical Achievement, IBM.
  • 2011: Scientific Excellence, CNRS.
  • 2010: Google Research Award
  • 2010: Top cited paper in the journal Discrete Optimization for "An algorithmic framework for Convex Mixed Integer Programs.
  • 2007: IBM Research Division Award.

Previous employments

  • 2008-2013: Permanent Researcher, CNRS, LIF Marseille (France). Currently on leave.
  • 2006-2008: Supplemental Research Staff Member, Mathematical dept, IBM Research, Yorkotown Heights (NY).
  • 2004-2006: Post-doctoral Fellow, Tepper School of Business, Carnegie Mellon University, Pittsburgh (PA).
  • 2000-2004: PhD Candidate, Université Paris 6, Paris (France).

Service Activities:

  • Project Manager for Bonmin and CglLandP.

  • Associate Editor for EURO Journal on Computational Optimization.

  • Permanent member of the COIN-OR foundation.

  • Guest editor for a special issue of Math. Programming B. on MINLP.

  • Organizing and program committee of MIP 2009 (USC Berkley, Berkley, June 2009)

  • Organizing and program committee of EWMINLP10 (CIRM, Marseille, April 2010)

  • Organizing committee workshop on MINLP in Dagstuhl (upcoming February 2018)





Technical Areas